At a Glance
- Tasks: Develop and optimise advanced semiconductor assembly processes for cutting-edge technologies.
- Company: Join a leading firm in semiconductor packaging with a focus on innovation.
- Benefits: Competitive salary, career growth, and opportunities to work with advanced technologies.
- Other info: Dynamic team environment with a focus on continuous improvement and innovation.
- Why this job: Make a real impact in the tech world by bridging development and production.
- Qualifications: Degree in Engineering or related field; experience in semiconductor manufacturing preferred.
Wolviston Management Services is supporting our amazing client in the recruitment of a Process Engineer to join their growing team. Due to continued growth and investment in advanced packaging and assembly capability, they are expanding their Process Engineering function to support the transition of new technologies into stable, high-yield manufacturing.
The Role
This position will focus on the development, optimisation and control of advanced semiconductor module assembly processes, with a particular emphasis on die attach and wire/ribbon bonding technologies. The successful candidate will play a key role in bridging development and production, ensuring processes are robust, scalable and capable of supporting future technology requirements.
Key Responsibilities
- Technology & Roadmap Development
- Collaborate with Engineering to identify and mature manufacturing technologies aligned to future product requirements.
- Evaluate emerging assembly and interconnect technologies to support increased power density and frequency performance.
- Assess manufacturability, scalability and cost implications of new technologies.
- Lead feasibility trials and proof-of-concept activities.
- Support supplier evaluation and make/buy decisions.
- Die Attach Process Engineering
- Develop and optimise processes including silver epoxy, silver sinter and eutectic attach (AuSn).
- Define process parameters (temperature, pressure, time and atmosphere).
- Deliver process validation, qualification and reliability testing.
- Characterise bond performance including voiding, bond line thickness and thermal resistance.
- Support material selection and supplier development.
- Wire Bonding Development
- Establish and optimise gold wire and ribbon bonding processes (ball and wedge).
- Define process parameters across varying substrates and metallisation types.
- Perform mechanical testing (pull/shear) and reliability assessments.
- Resolve bonding challenges including intermetallic formation and pad integrity.
- Support fine-pitch and high-frequency assembly requirements.
- Manufacturing & Continuous Improvement
- Define, document and control manufacturing processes and workflows.
- Develop SOPs, control plans and process documentation.
- Monitor process capability (SPC, Cp/Cpk) and drive yield improvements.
- Lead root cause investigations using structured methodologies (8D, DMAIC, FMEA).
- Deliver continuous improvement initiatives targeting cost, quality and cycle time.
- New Product Introduction (NPI)
- Support DFM/DFA activities during product development.
- Develop pilot builds and process validation strategies.
- Work cross-functionally to ensure smooth transition into production.
- Define tooling, fixturing and automation requirements.
Requirements
- Essential Degree in Engineering, Materials Science, Physics or related discipline.
- Experience in semiconductor or RF module manufacturing environments.
- Hands-on experience with at least one of the following:
- Silver epoxy die attach.
- Silver sintering.
- Eutectic die attach.
- Gold wire bonding.
- Strong understanding of materials behaviour and thermal management.
- Experience in process validation and statistical analysis.
- Proven problem-solving capability within a manufacturing setting.
- Desirable Background in high-precision electronics, automotive or power electronics manufacturing.
- Experience in high-tech or semiconductor production environments.
- Knowledge of RF packaging and JEDEC standards.
- Experience with equipment specification and commissioning.
- Familiarity with thermomechanical modelling and reliability testing.
- Understanding of ISO 9001 or IATF 16949 quality systems.
Key Attributes
- Analytical, structured and detail-oriented approach.
- Strong cross-functional collaboration skills.
- Ability to translate technical requirements into practical manufacturing solutions.
- Hands-on and proactive within a production environment.
- Comfortable working across both development and operations.
- Capable of managing priorities in a fast-paced, scaling organisation.
Process Engineer – Advanced Semiconductor Packaging in North East employer: Wolviston Management Services Ltd
As an Engineering Manager at our major UK manufacturing site in Greatham, you will be part of a dynamic and innovative work culture that prioritises engineering excellence and continuous improvement. We offer competitive benefits, a commitment to employee development, and the chance to lead multidisciplinary teams in a pivotal role that directly impacts plant performance and safety. Join us to make a meaningful contribution in a supportive environment that values your expertise and fosters professional growth.
Contact Details:
Wolviston Management Services Ltd Recruitment Team
StudySmarter Expert Advice🤫
We think this is how you could land Process Engineer – Advanced Semiconductor Packaging in North East
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We think you need these skills to ace Process Engineer – Advanced Semiconductor Packaging in North East
Some tips for your application 🫡
Showcase Your Technical Skills:In the manufacturing-production sector, it's crucial to highlight your technical skills and experience. Make sure your CV features any relevant qualifications, such as certifications in machinery operation or production management, and don’t forget about any specific systems or software you’re familiar with. This can really set you apart!
Emphasise Teamwork and Communication:Working in manufacturing often means being part of a larger team. Highlight your experience in collaborative projects or environments where communication was key. Maybe you have experience with lean manufacturing principles? Talk about how you worked with your team to improve productivity and maintain quality.
Tailor Your Cover Letter to the Company:Don’t just recycle an old cover letter! Take the time to tailor your cover letter to Wolviston Management Services Ltd specifically. Mention what excites you about their production processes or products, and how your previous experiences can contribute to their goals. We want to see your enthusiasm for the role!
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How to prepare for a job interview at Wolviston Management Services Ltd
✨Know Your Manufacturing Processes
Before you walk into the interview with Wolviston Management Services Ltd, brush up on the specific manufacturing processes relevant to the role. Understanding lean manufacturing principles or quality control techniques could give you a solid edge to discuss how you’d fit into their operations.
✨Technical Questions Are Key
Be prepared for technical questions around machinery, production scheduling, or materials handling. Make sure you can confidently explain how you've dealt with these in past experiences or internships. Knowing industry-specific software could also be a big plus!
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Manufacturing environments often focus on continuous improvement. Be ready to discuss specific instances where you’ve solved a production issue or implemented a process improvement. It’s all about demonstrating your analytical thinking and hands-on approach.
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