Microelectronics Process Engineer: Wire Bonding & Die Attach in Bedlington

Microelectronics Process Engineer: Wire Bonding & Die Attach in Bedlington

Bedlington Full-Time No working from home possible
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TT Electronics Bedlington is seeking a Process Engineer to join the Engineering team in the Chip and Wire Assembly function. The role drives continuous improvement across die attach, wire bonding, encapsulation, and related assembly operations to ensure product quality, yield, and reliability meet stringent industry standards.

The successful candidate will lead cross-functional collaboration with production, quality, and equipment engineering, introducing new products, resolving process issues,

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Contact Details:

TT Electronics Recruitment Team