Mid-Senior IC Package Designer | 2.5D/3D Packaging in Cambridge
Mid-Senior IC Package Designer | 2.5D/3D Packaging

Mid-Senior IC Package Designer | 2.5D/3D Packaging in Cambridge

Cambridge Full-Time No home office possible
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A leading semiconductor company seeks an experienced IC Package Designer/Developer in Cambridge, UK. This role involves developing cost-effective packaging designs and requires strong substrate design experience. Candidates should hold a Bachelor\’s degree in Electronics/Electrical Engineering and have 3 to 8+ years of relevant experience, particularly with Cadence Allegro Package Designer. Join a dynamic team and contribute to innovative semiconductor solutions. #J-18808-Ljbffr

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Contact Detail:

Tessolve Recruiting Team

Mid-Senior IC Package Designer | 2.5D/3D Packaging in Cambridge
Tessolve
Location: Cambridge

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