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- Tasks: Design high-speed interconnect systems and collaborate with cross-functional teams.
- Company: Thriving semiconductor scale-up focused on energy-efficient AI systems.
- Benefits: Highly competitive salary and opportunities for professional growth.
- Why this job: Join a cutting-edge company and make an impact in the AI revolution.
- Qualifications: 5 years of semiconductor package design experience and a Bachelor's in Electronic Engineering.
- Other info: Dynamic work environment with a focus on innovation and collaboration.
The predicted salary is between 43200 - 72000 £ per year.
A Senior Package Design Engineer with extensive hands-on experience using Cadence APD/Allegro tools, experience with Ansys/AutoCAD and SI/PI Simulation tools will join a thriving Semiconductor scale-up enabling the build of scalable, energy efficient AI systems Worldwide. The Senior Package Design Engineer will undertake all package design activities with cross functional team collaboration delivering high speed interconnect systems; ensuring cost effective methodologies are incorporated, completing verification of electrical characteristics of the package and providing support to assembly related activities.
The Senior Package Design Engineer should possess the following skills & experience:
- 5 years Semiconductor Package design using Cadence APD/Allegro tools
- Expertise with Cadence (Virtuoso/Extract IM/Power DC) / Ansys SW tools
- Using AutoCAD
- Experience of IC physical layout
- Minimum of Bachelors Electronic Engineering Degree
- A basic understanding of Thermal and mechanical behaviour of IC Packages
This exciting Semiconductor Company will offer a highly competitive salary package to the successful Senior Package Design Engineer.
Locations
Senior IC Package Design Engineer in Glasgow, Scotland employer: Technical Futures.
Contact Detail:
Technical Futures. Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land Senior IC Package Design Engineer in Glasgow, Scotland
✨Tip Number 1
Network like a pro! Reach out to your connections in the semiconductor industry and let them know you're on the hunt for a Senior Package Design Engineer role. You never know who might have the inside scoop on job openings or can put in a good word for you.
✨Tip Number 2
Show off your skills! When you get the chance to chat with potential employers, be ready to discuss your hands-on experience with Cadence APD/Allegro tools and any projects you've worked on. Bring examples of your work to the table; it’ll make you stand out!
✨Tip Number 3
Stay updated on industry trends! Keep an eye on the latest developments in AI systems and semiconductor technologies. This knowledge will not only help you in interviews but also show that you're genuinely interested in the field.
✨Tip Number 4
Apply through our website! We’ve got loads of exciting opportunities waiting for talented engineers like you. Don’t miss out on the chance to join a thriving scale-up and make a real impact in the semiconductor world.
We think you need these skills to ace Senior IC Package Design Engineer in Glasgow, Scotland
Some tips for your application 🫡
Show Off Your Skills: Make sure to highlight your hands-on experience with Cadence APD/Allegro tools and any other relevant software like Ansys or AutoCAD. We want to see how your skills align with the role, so don’t hold back!
Tailor Your Application: Take a moment to customise your CV and cover letter for this specific position. Mention your experience in semiconductor package design and how it relates to building scalable, energy-efficient AI systems. We love seeing candidates who take the time to connect their background to our needs.
Be Clear and Concise: When writing your application, keep it straightforward and to the point. Use bullet points where possible to make it easy for us to read through your qualifications and experiences. We appreciate clarity!
Apply Through Our Website: Don’t forget to submit your application through our website! It’s the best way for us to receive your details and ensures you’re considered for the role. Plus, it helps us keep everything organised!
How to prepare for a job interview at Technical Futures.
✨Know Your Tools Inside Out
Make sure you’re well-versed in Cadence APD/Allegro tools, Ansys, and AutoCAD. Brush up on your knowledge of these tools before the interview, as you’ll likely be asked about your hands-on experience and how you’ve used them in past projects.
✨Showcase Your Collaboration Skills
Since the role involves cross-functional team collaboration, be prepared to discuss examples of how you've worked with others in previous roles. Highlight any successful projects where teamwork was key to delivering high-speed interconnect systems.
✨Demonstrate Your Problem-Solving Abilities
Be ready to talk about challenges you've faced in package design and how you overcame them. This could include issues related to electrical characteristics or assembly activities. Showing your analytical skills will impress the interviewers.
✨Understand the Bigger Picture
Familiarise yourself with the latest trends in semiconductor technology, especially regarding energy-efficient AI systems. Being able to discuss how your work contributes to these advancements will show your passion for the industry and the role.
