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- Tasks: Design innovative IC packages and ensure efficient methodologies for AI systems.
- Company: Thriving semiconductor scale-up focused on energy-efficient technology.
- Benefits: Highly competitive salary and opportunities for professional growth.
- Other info: Dynamic work environment with a focus on innovation and collaboration.
- Why this job: Join a cutting-edge team and shape the future of AI technology.
- Qualifications: 5 years in IC package design with Cadence tools and an Electronic Engineering degree.
The predicted salary is between 48000 - 72000 £ per year.
An IC Package Design Engineer with extensive hands-on experience using Cadence APD/SIP will join a thriving High Technology scale-up, enabling the build of scalable, energy efficient AI systems Worldwide. The IC Package Design Engineer will undertake all package design activities; ensuring cost effective methodologies are incorporated, completing verification of electrical characteristics of the package and providing support to Assembly related activities.
The IC Package Design Engineer should possess the following skills & experience:
- Proven top level Package design and RLC parasitic extraction.
- 5 years in IC Package design using Cadence APD/SIP.
- Using Cadence (Virtuoso/Extract IM/Power DC) / Ansys / SQW Tools (SiWave/Q3D).
- Using AutoCAD tool.
- Knowledge of various IC Packaging technology.
- Electronic Engineering related Degree qualification.
- A basic understanding of Thermal and mechanical behaviour of IC Packages.
This exciting Semiconductor Company will offer a highly competitive salary package to the successful IC Package Design Engineer.
Locations
IC Package Design Engineer in Glasgow, Scotland employer: Technical Futures.
Contact Detail:
Technical Futures. Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land IC Package Design Engineer in Glasgow, Scotland
✨Tip Number 1
Network like a pro! Reach out to your connections in the semiconductor industry and let them know you're on the hunt for an IC Package Design Engineer role. You never know who might have the inside scoop on job openings or can put in a good word for you.
✨Tip Number 2
Show off your skills! When you get the chance to chat with potential employers, be ready to discuss your hands-on experience with Cadence APD/SIP and other tools. Share specific examples of how you've tackled package design challenges and what methodologies you've used to ensure cost-effectiveness.
✨Tip Number 3
Prepare for technical interviews! Brush up on your knowledge of RLC parasitic extraction and various IC packaging technologies. Be ready to answer questions about thermal and mechanical behaviour of IC packages, as this will show you're not just book-smart but also practical.
✨Tip Number 4
Don't forget to apply through our website! We’ve got some fantastic opportunities waiting for you, and applying directly can sometimes give you an edge. Plus, it’s super easy to keep track of your applications and updates!
We think you need these skills to ace IC Package Design Engineer in Glasgow, Scotland
Some tips for your application 🫡
Tailor Your CV: Make sure your CV highlights your experience with Cadence APD/SIP and any relevant IC package design projects. We want to see how your skills match up with what we're looking for, so don’t be shy about showcasing your expertise!
Craft a Compelling Cover Letter: Your cover letter is your chance to shine! Use it to explain why you're passionate about IC package design and how your background makes you a perfect fit for our team. We love hearing personal stories that connect your experience to the role.
Showcase Your Technical Skills: Don’t forget to mention your proficiency with tools like Ansys, AutoCAD, and any other relevant software. We’re keen on seeing how you’ve used these tools in past projects, so give us some juicy details!
Apply Through Our Website: We encourage you to apply directly through our website. It’s the best way for us to keep track of your application and ensures you get all the latest updates from us. Plus, it shows you’re serious about joining our awesome team!
How to prepare for a job interview at Technical Futures.
✨Know Your Tools Inside Out
Make sure you’re well-versed in Cadence APD/SIP, as well as other tools like Ansys and AutoCAD. Brush up on your knowledge of RLC parasitic extraction and be ready to discuss how you've used these tools in past projects.
✨Showcase Your Experience
Prepare specific examples from your 5 years in IC Package design that highlight your skills. Talk about the methodologies you’ve implemented and how they contributed to cost-effective solutions in your previous roles.
✨Understand the Bigger Picture
Familiarise yourself with the latest trends in IC packaging technology and energy-efficient AI systems. Being able to discuss how your work fits into the broader context of the company’s goals will impress the interviewers.
✨Ask Insightful Questions
Prepare thoughtful questions about the company’s projects and challenges. This shows your genuine interest in the role and helps you gauge if the company is the right fit for you.