Design Engineer in Dundee

Smiths Interconnect is a global leader in the design and manufacture of high-performance interconnect solutions. Our products are used in mission-critical applications across industries such as aerospace, defense, telecommunications, and industrial markets. We are committed to innovation, quality, and providing cutting-edge solutions that connect the world’s most demanding systems.

Job Description:

• Create detailed cable, connector, and contact designs on 3D or 2D CAD system.
• Technical lead for the development of interconnect solutions including design of contacts, insulators, cabling and latching mechanisms.
• Support Senior Design Engineer for development of complex interconnect solutions.
• Coordinate the construction of functional and non-functional prototypes with internal and external vendors.
• Lead/support group design reviews using calculations, experimental results or research.
• Technical lead during the new product introduction process, including assisting manufacturing with tooling adjustments.
• Provide technical support for existing products.
• Apply principles of electrical engineering as they pertain to connectors, contact technology and cable design.
• Generate test procedures and test and/or oversee testing of new designs as necessary.
• Perform risk analysis such as FMEA as it pertains to AS9100.
• Be able to travel domestically and internationally.

Qualifications:

• Bachelor’s degree in Mechanical Engineering, MSME preferred.
• 5-7 years minimum work experience in Military & Aerospace industry.
• Working knowledge of CAD software, Solid works preferred.
• Knowledge of ANSYS (FEA) and Mold flow or equivalents.
• Knowledge of polymeric materials, metals and coatings.
• Knowledge of principles of Electrical Engineering.

Additional Information:

• Hands-on prototype development experience, preferably including rapid prototyping.
• Familiarity with coaxial and fiber optic connectors and knowledge of connector sealing and shielding a plus.
• Familiar with transmission line theory and digital signal transmission.
• Familiar with high frequency RF applications at up to 40 GHz.
• Working knowledge of Printed Circuit Board assembly, specifically Surface Mount Technology, Pick and Place and IR Reflow.
• Experience with the application of BGAs (Ball Grid Arrays).
• Experience with soldering process, platings and specifications.
• Experience with ESA, NASA or Department of Defense Electronics design, i.e., manned and unmanned vehicle, ordinance development or production.
• FMEA experience.
• Familiar with Root Cause Analysis utilizing standard problem-solving tools and methodologies.
• Familiar with Project Management Techniques (e.g. GANTT charts, risk management).

We believe that different perspectives and backgrounds are what make a company flourish. All qualified applicants will receive equal consideration for employment regardless of color, religion, sex, sexual orientation, gender identity, national origin, economic status, disability, age, or any other legally protected characteristics. We are proud to be an inclusive company with values grounded in equality and ethics, where we celebrate, support, and embrace diversity.