Photonics Packaging Scientist

Science Led, Enterprise Driven – Accelerating Quantum Computing. Quantinuum is the world’s largest integrated quantum company, pioneering powerful quantum computers and advanced software solutions. Quantinuum’s technology drives breakthroughs in materials discovery, cybersecurity, and next-gen quantum AI. With approximately 500 employees, including 370+ scientists and engineers, Quantinuum leads the quantum computing revolution across continents.

We are seeking a Photonics Packaging Scientist in our New Mexico location. We are looking for an engineer with broad experience in packaging of photonic integrated circuits (PICs) to develop innovative and reliable packaging schemes for the highly scaled ion traps in our quantum computers.

All applicants for placement in safety-sensitive positions will be required to submit to a pre-employment drug test.

Key Responsibilities:

• Develop and implement advanced packaging concepts for optical and detection interfaces to next-generation ion traps.
• Develop packaging strategies and processes for large-format ion trap chips with high I/O signal count and density.
• Work with vendors to implement and validate packaging processes.
• Support all stages of ion trap development to ensure compatibility with packaging.
• Interface with broader Quantinuum team to ensure ion trap packaging meets system requirements.
• Engage with 3rd parties to cultivate possible key partnerships, supplier relationships, and co-development opportunities.

YOU MUST HAVE:

• Bachelor’s degree minimum.
• Minimum 3 years’ experience in advanced PIC packaging development.
• Due to contractual requirements, must be a U.S. Person, defined as a U.S. citizen, permanent resident or green card holder, workers granted asylum or refugee status.
• Due to national security requirements imposed by the U.S. Government, candidates for this position must not be a People's Republic of China national or Russian national unless the candidate is also a U.S. citizen.

WE VALUE:

• PhD in Physics or Engineering.
• 7 years’ experience with advanced PIC packaging technologies and fiber-to-chip coupling.
• 5 years’ experience with high-density photonic I/O technologies.
• 5 years’ experience with visible-wavelength PIC packaging.
• 3 years’ experience with large area chips, multi-chip packaging, bump bonding, heterogeneous integration and 2.5-3D packaging techniques.
• A proven track record of innovation and IP development.
• Experience working with Outsourced Semiconductor Assembly and Test (OSAT) vendors.
• Experience setting up a packaging lab, with knowledge of the equipment and vendors.
• Experience working within a cross-functional team environment.

Compensation & Benefits:

• Estimated Salary Wage: $123,000 - $153,000 Annually.
• A competitive salary and innovative, game-changing work.
• Flexible work schedule.
• Employer subsidized health, dental, and vision insurance.
• 401(k) match for student loan repayment benefit.
• Equity, 401k retirement savings plan + 12 Paid holidays and generous vacation + sick time.
• Paid parental leave.
• Employee discounts.

Quantinuum is an equal opportunity employer. You will be considered without regard to age, race, creed, color, national origin, ancestry, marital status, affectional or sexual orientation, gender identity or expression, disability, nationality, sex, or veteran status.