At a Glance
- Tasks: Design and optimise package layouts while collaborating with diverse teams.
- Company: Join Qualcomm, a leader in innovative technology based in Cambridge.
- Benefits: Enjoy competitive salary, stock options, family leave, and comprehensive insurance.
- Other info: Dynamic team environment with opportunities for growth and development.
- Why this job: Be at the forefront of packaging technology and drive real innovation.
- Qualifications: Bachelor's or Master's in Engineering and experience with Cadence Allegro tools.
The predicted salary is between 45000 - 55000 £ per year.
Qualcomm in Cambridge is seeking an IC Package Design Engineer to join their Central Hardware Systems Team. This role involves responsibilities such as designing and optimizing package layouts, collaborating with multi-functional teams, and driving innovations in packaging technology.
The ideal candidate will have a Bachelor's or Master's degree in Engineering and experience with Cadence Allegro tools.
Competitive salary and comprehensive benefits package include stock options, family leave, and various insurance benefits.
IC Package Design Engineer – High-Speed & 2.5D/3D Packaging in Cambridge employer: Qualcomm
Qualcomm in Cambridge is an exceptional employer, offering a dynamic work culture that fosters innovation and collaboration within the Central Hardware Systems Team. Employees benefit from a competitive salary, comprehensive benefits including stock options and family leave, and ample opportunities for professional growth in a cutting-edge technology environment.
