Lead Engineer, 3D Integration & Advanced Packaging in London

About Quantum Motion

Quantum Motion is a quantum computing scale‑up based in London, developing silicon‑based quantum processors that aim to transform computing power in areas such as materials modelling, medicine, and artificial intelligence.

Role Overview

We are looking for a visionary and hands‑on 3D Integration and Advanced Packaging Lead to bridge the gap between cutting‑edge silicon spin qubit devices and scalable quantum systems.

You will build and lead a team to drive the R&D of complex, multi‑chip modules utilizing TSVs and microbumps, optimized to operate at millikelvin temperatures.

Responsibilities

• Recruit, mentor, and lead a high‑performing team of packaging, signal integrity, materials, and quantum integration engineers.
• Drive the strategy, design, and rapid prototyping of 3D integrated circuits and multi‑chip quantum modules.
• Ensure all packaging architectures and interconnects can withstand thermal cycling down to millikelvin regimes without delamination or performance degradation.
• Own relevant operations with external foundries, OSATs, and research partners, and seamlessly transfer novel packaging designs to external manufacturing lines.
• Serve as the critical link between design, process integration, cryo R&D, and quantum hardware teams to co‑optimise the electrical, thermal, and mechanical design.
• Balance rapid R&D prototyping with a rigorous, parallel focus on yield improvement, failure analysis, and long‑term reliability.

Qualifications

• Master's or Ph D in electrical engineering, materials science, physics, microelectronics, or a related field.
• 7+ years of deep technical experience in 3D integration, specifically with TSVs, fine‑pitch microbumps, flip‑chip bonding, and/or multi‑chip modules.
• Proven track record of building, scaling, and managing engineering teams in high‑tech, fast‑paced environments.
• Strong experience managing technical transfers and collaborating closely with external semiconductor foundries or advanced packaging facilities.
• Proficiency with industry‑standard simulation tools such as Ansys HFSS/Q3D or Cadence for modeling signal integrity, thermal stress, and mechanical behaviour.
• Direct experience with cryogenic electronics.
• Background or strong familiarity with solid‑state quantum mechanics, silicon spin qubits, or semiconductor physics.
• Knowledge of materials behaviour (superconductors, low‑loss dielectrics) at extreme temperatures.
• Location
• Central London (Islington)

Benefits

• Competitive salary and share options scheme.
• Contributory pension scheme.
• Group private medical insurance scheme.
• Life assurance.
• Cycle‑to‑work scheme.
• Equal Employment Opportunity

Quantum Motion is committed to providing equal employment opportunity and does not discriminate based on age, sex, sexual orientation, gender identity, race, colour, religion, disability status, marital status, pregnancy, gender reassignment or any other protected characteristics covered by the Equality Act 2010.

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