Principal Process Engineer - Metal-Oxide PVD

We have a fantastic new opportunity for an exceptional PVD Process Engineer to join our Process Engineering group at Pragmatic Semiconductor in Durham. Based at our 300mm manufacturing site, Pragmatic Park, and reporting to the Head of Process Engineering, this is a critical role with responsibility for technical leadership of metal-oxide Physical Vapor Deposition (PVD) processes.

In this role you will combine deep process ownership with line management of a small deposition team (1 x ALD Process Engineer and 1 x Metal PVD Process Engineer). You will set the technical direction for metal-oxide PVD film stacks, and drive process and equipment improvements from development through high-volume manufacturing. We are looking for candidates with deep technical knowledge of PVD processes, and ideally some knowledge of ALD and CVD. The ability or desire to lead and grow a team would be highly desirable, as well as highly-effective communication skills that will help you to succeed in a fast-paced business that thrives on collaboration. This role is based in Durham, UK, with Visa sponsorship and relocation assistance available for the right candidate.

This is an excellent opportunity in the business during a critical period of growth, given that the remit will genuinely allow you to lead the PVD group and make a key impact.

Key tasks:

• Own metal-oxide PVD process development, qualification, and sustaining for production tools (e.g., reactive sputter, RF/DC magnetron, co-sputter systems).
• Define and optimise process windows (deposition rate, stoichiometry, film stress, resistivity, uniformity, particle performance) for metal-oxide stacks used in downstream device integration.
• Lead root-cause investigations for excursions, drift, and yield-limiting mechanisms tied to PVD film properties; partner with equipment engineering on chamber hardware, target/cathode life, and preventive maintenance strategy.
• Drive statistical process control (SPC) implementation and interpretation for PVD process parameters and film metrology; establish and maintain control limits and capability targets (Cpk) for critical-to-quality outputs.
• Lead or support change control documentation for process changes and equipment modifications, ensuring proper qualification and risk assessment prior to release.
• Collaborate with integration, device, reliability, and equipment engineering teams to align PVD film performance with overall process flow requirements.
• Evaluate and qualify new equipment, chamber configurations, or process technologies to support roadmap and yield/cost targets.
• Directly manage and develop a small team.
• Provide day-to-day technical mentorship and hands-on coaching in deposition fundamentals, equipment troubleshooting methodology, and data-driven process improvement.
• Balance individual workload and priorities across the team, ensuring coverage for tool ownership, shift support, and project deliverables.

Qualifications and training:

Candidates will ideally be educated to degree or PhD level in a relevant field such as Materials Science, Physics, Chemical or Electrical Engineering (or will possess equivalent technical experience). Six Sigma / Lean process improvement certification would be beneficial, but not essential.

Skills and experience:

• Extensive process engineering experience in semiconductor or thin-film manufacturing, with significant depth in metal-oxide PVD / reactive sputtering.
• Working knowledge of ALD process fundamentals (sufficient to guide and support an ALD engineer's technical work).
• Deep, hands-on experience with reactive DC/RF magnetron sputtering for metal-oxide films.
• Demonstrated ownership of process modules through development, qualification, and high-volume manufacturing transfer.
• Strong knowledge of statistical process control, DOE methodology, and process capability analysis.
• Experience managing engineers or leading a technical team (desirable).
• Proficiency with statistical/data analysis tooling for process data (e.g., R, R-Markdown, JMP, Minitab, or equivalent).
• Strong written and verbal communication skills, including presenting to cross-functional and management audiences.
• Chamber-level troubleshooting: target/cathode behaviour, arcing, plasma instability, particle excursions, and film stress control.
• Experience with co-sputtering, multi-target systems, or advanced reactive gas control schemes (desirable).
• Familiarity with change-control and documentation systems typical of a regulated or high-mix fab environment (desirable).

Candidates who do not meet every requirement but feel their skills are a good fit for the role are encouraged to apply. Pragmatic Semiconductor is committed to equity, equality, diversity, and inclusion; we strive to welcome everyone and create inclusive teams. We celebrate difference and encourage everyone to be themselves at work. Please let us know if you would like any adjustments to our application and interview process.