Pragmatic Semiconductor is seeking a Principal Advanced Packaging Engineer to lead the technical development of FlexIC wafer-level and chip-scale packaging, die attachment, and system integration across Sedgefield and Durham sites. The role requires deep experience in semiconductor packaging, MEMS/flexible electronics, and cross-functional collaboration.
Visa sponsorship and relocation assistance are available.
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Principal Advanced Packaging Engineer: Lead FlexIC Packaging employer: Pragmatic Semiconductor
Pragmatic Semiconductor is an exceptional employer, offering a dynamic work environment in Durham where innovation and collaboration thrive. With a strong focus on employee growth, the company provides opportunities for professional development and champions sustainable practices, making it an ideal place for those passionate about procurement in the high-tech manufacturing sector. Join a team that values diversity and inclusion, ensuring every voice is heard and every contribution is recognised.
