At a Glance
- Tasks: Lead advanced semiconductor packaging from concept to production for high-performance devices.
- Company: Join a leading tech firm in London focused on cutting-edge AI hardware.
- Benefits: Enjoy a hybrid working model and competitive salary with growth opportunities.
- Other info: Dynamic role with cross-disciplinary development and innovative projects.
- Why this job: Be at the forefront of technology, shaping the future of AI hardware packaging.
- Qualifications: Experience in semiconductor packaging and strong collaboration skills required.
The predicted salary is between 60000 - 80000 £ per year.
Platform Recruitment's client in London is seeking an experienced Senior / Staff Packaging Engineer to lead advanced semiconductor packaging from concept to production. You will work on package, substrate and system-level integration for high-performance devices, collaborating with ASIC, hardware and systems teams to deliver cutting-edge packaging solutions.
The role involves cross-disciplinary development across design, layout, simulation, and product development, with a hybrid working model.
Senior Packaging Engineer: High-Perf AI Hardware (Hybrid) in London employer: Platform Recruitment
As an Electronics Engineer at our Cambridge location, you will be part of a dynamic team that values innovation and collaboration, offering a stimulating work environment where your contributions directly impact high-performance electronic systems. We provide competitive salaries, comprehensive benefits, and ample opportunities for professional growth, ensuring that you can advance your career while enjoying a supportive and inclusive workplace culture.
