Senior Packaging Engineer

About OLIX AI is growing faster than any technology in history and the explosion in demand has created a massive infrastructure gap; we can no longer build chips or power stations fast enough to keep up. The industry is still leaning on a ten-year-old hardware blueprint that has reached its limit. A new paradigm that is faster and more efficient will be the biggest economic opportunity of the next century and create the most important company of the next decade. OLIX is building this next paradigm; the Optical Tensor Processing Unit (OTPU) achieves performance and energy efficiency that is impossible to match from existing chips.

Role At OLIX, the performance of our technology depends not only on silicon design, but on how effectively that silicon is packaged, integrated, and scaled into products. As we move from early architecture and prototype development toward productisation, the Senior / Staff Packaging Engineer will play a critical role in defining and delivering the packaging solutions that enable our ASICs to become high-performance systems. This is a hands‑on, high‑impact engineering role focused on front‑end package design, ASIC‑to‑substrate integration, and advanced 2.5D and 3D packaging. You will work across silicon, substrate, package, and board‑level interfaces to ensure package solutions meet performance, manufacturability, and integration requirements from concept through to production readiness. You will lead packaging engineering across the full development flow, including package architecture, detailed design, layout, simulation, and product readiness. This includes defining package design methodologies, owning substrate design, delivering PI/SI simulations, and supporting substrate and PCB integration as needed. Working closely with the ASIC team, you will translate die requirements into package solutions that are electrically robust, manufacturable, and ready for system integration. A key part of the role will be owning the end‑to‑end package design flow for next‑generation AI hardware, including package architecture, bump and substrate design, package layout, high‑speed and power delivery integration, PI/SI‑driven optimisation, and substrate/PCB co‑design.

Responsibilities Advanced Package Architecture you’re owning a piece of it.

Proximity Bonus: We value your time. To minimise your commute and maximise your life, we offer a £24k annual Living‑Local Bonus if your residence is within 20 minutes of the office.