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- Tasks: Lead R&D and design of advanced RF interconnect solutions for next-gen photonic products.
- Company: Join a leading tech company focused on innovative optical solutions.
- Benefits: Competitive salary, bonus potential, and opportunities for remote work.
- Why this job: Be at the forefront of photonic technology and make a real impact in the industry.
- Qualifications: PhD in relevant field and 10+ years of experience in RF interconnect design.
- Other info: Collaborative environment with mentorship opportunities and career growth.
Molex is seeking a Principal Signal Integrity Design Engineer to join our Optical Solutions Business Unit (OSBU). In this role, the successful candidate will be part of a world‑class engineering team, contributing to the development of next‑generation Photonic Integrated Circuits (PICs). The successful candidate will be responsible for designing, implementing, and validating advanced RF interconnects for PICs, transceivers, and optical engines. The Principal Signal Integrity Design Engineer will provide design support for existing and advanced photonic technology and collaborate with global, cross‑functional teams and supplier partners to develop next‑generation photonic solutions.
The PIC Components and Technology Development team are responsible for the research and development of advanced technology platforms and solutions for the next generation of optical connectivity in AI fabrics, data centers, and datacom applications. Reporting to the Director of Photonics Technology, you will be a key member of the team and will serve as the technical lead for developing advanced integrated RF interconnect technologies such as TSV and EPIC for 400G/L PAM4, CPO, and 1.6T/3.2T coherent products and will closely collaborate with the PIC component design, signal integrity, layout, test & reliability, and transceiver design teams as well as with external partners like semiconductor foundries, OSATs, CMs, and vendors. This role can be based anywhere in the United States or Canada.
What You Will Do
- Lead the R&D, design, and EVT/DVT activities with regards to developing advanced integrated RF interconnect solutions for 400G/L PAM4, CPO, and 1.6T/3.2T coherent products.
- Collaborate with the SI/PI, opto‑mechanics, packaging, and test and reliability teams to provide appropriate test vehicles for EVT/DVT of advanced integrated RF interconnects.
- Work with external partners, foundries, contract manufacturers, and OSATs to develop required processes and demonstrate production‑level performance, reliability, and quality.
- Intimately collaborate with the SI/PI and transceiver design teams to build and validate predictive RF models for pluggables and transponders including external ASICs components such as DRV, TIA, DSP (LPO, LRO).
- Collaborate with the PIC component design and PDK teams in developing advanced modulator devices for the next generation of PIC products.
- Mentor other SI/PI engineers and cross‑functional groups on advanced EM simulation and design techniques based on commercial software tools and custom codes.
Who You Are (Basic Qualifications)
- PhD typically in Electrical Engineering, Microwave Photonics, Physics or related technical fields.
- At least 10 years of relevant industry experience in designing advanced RF interconnects and/or signal/power integrity for optical connectivity applications.
- Expertise of Si and/or III‑V photonic integrated circuits (PICs).
- Experience with CMOS semiconductor and backend processes as well as packaging ecosystem.
- Expert level user of commercial modeling tools such as Ansys HFSS, ADS, or equivalent software.
For this role, we anticipate paying $200,000 - $300,000 per year. This role is eligible for variable pay, issued as a monetary bonus or in another form.
Principal SI Design Engineer in Bristol employer: Ofcconference
Contact Detail:
Ofcconference Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land Principal SI Design Engineer in Bristol
✨Tip Number 1
Network like a pro! Reach out to your connections in the industry, especially those who work at Molex or similar companies. A friendly chat can sometimes lead to insider info about job openings or even a referral.
✨Tip Number 2
Prepare for interviews by brushing up on your technical skills and knowledge about photonic integrated circuits. We recommend doing mock interviews with friends or using online platforms to get comfortable with common questions.
✨Tip Number 3
Showcase your projects! If you've worked on relevant RF interconnects or signal integrity designs, create a portfolio that highlights your best work. This can really set you apart during interviews.
✨Tip Number 4
Don’t forget to apply through our website! It’s the best way to ensure your application gets seen by the right people. Plus, it shows you’re genuinely interested in joining our team at Molex.
We think you need these skills to ace Principal SI Design Engineer in Bristol
Some tips for your application 🫡
Tailor Your CV: Make sure your CV is tailored to the Principal Signal Integrity Design Engineer role. Highlight your experience with RF interconnects and photonic integrated circuits, as well as any relevant projects you've worked on. We want to see how your skills align with what we're looking for!
Craft a Compelling Cover Letter: Your cover letter is your chance to shine! Use it to explain why you're passionate about optical solutions and how your background makes you a perfect fit for our team. Don't forget to mention any collaborative experiences you've had with cross-functional teams.
Showcase Your Technical Skills: Since this role requires expertise in advanced RF interconnects and modelling tools, make sure to showcase your technical skills clearly. Mention specific software like Ansys HFSS or ADS that you’ve used, and any relevant achievements that demonstrate your capabilities.
Apply Through Our Website: We encourage you to apply through our website for a smoother application process. It helps us keep track of your application and ensures you get all the updates directly from us. Plus, it shows you're keen on joining our team!
How to prepare for a job interview at Ofcconference
✨Know Your Stuff
Make sure you brush up on your knowledge of RF interconnects and photonic integrated circuits. Be ready to discuss your past projects and how they relate to the role. Familiarise yourself with the latest trends in optical connectivity and be prepared to share your insights.
✨Showcase Collaboration Skills
Since this role involves working with cross-functional teams, think of examples where you've successfully collaborated with others. Highlight your experience with external partners and how you’ve contributed to team success in previous roles.
✨Prepare for Technical Questions
Expect some deep technical questions related to signal integrity and modelling tools like Ansys HFSS or ADS. Review key concepts and be ready to explain your thought process when solving complex engineering problems.
✨Ask Insightful Questions
At the end of the interview, have a few thoughtful questions ready about the team’s current projects or future challenges. This shows your genuine interest in the role and helps you assess if the company is the right fit for you.
