Nexperia is seeking a Principal Package Competence Engineer in the UK to drive advanced semiconductor packaging and assembly technologies. You will lead studies, evaluate emerging package concepts, and shape the packaging roadmap across global teams and sites.
You will also mentor engineers, contribute to patents, and partner with Business Groups to align technology initiatives with strategic objectives. This role offers a hybrid working model with strong development opportunities.
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Senior Package Engineering Lead – Power Semiconductors employer: Nexperia
At Nexperia, we pride ourselves on being an exceptional employer, offering a dynamic work environment that fosters innovation and collaboration. As a Principal Modelling Engineer, you will benefit from competitive remuneration, extensive professional development opportunities, and a strong commitment to diversity and inclusion. Our hybrid working policy, generous leave entitlements, and focus on corporate social responsibility make Nexperia a rewarding place to advance your career while contributing to cutting-edge technologies in the semiconductor industry.
