Nexperia in the United Kingdom is seeking a Principal Package Competence Engineer to drive advanced packaging for Power MOSFETs. You will lead design studies and serve as a recognised expert, shaping technology roadmaps and collaborating with product lines, assembly sites and R&D teams.
The role demands a PhD with 5+ years in packaging, plus experience in DOE, simulation, and failure analysis, with a proven record of innovation. Hybrid work, competitive pay, and global impact await.
#J-18808-Ljbffr
Lead Semiconductor Packaging Engineer in Manchester employer: Nexperia
At Nexperia, we pride ourselves on being an exceptional employer, offering a dynamic work environment that fosters innovation and collaboration. As a Principal Modelling Engineer, you will benefit from competitive remuneration, extensive professional development opportunities, and a strong commitment to diversity and inclusion. Our hybrid working policy, generous leave entitlements, and focus on corporate social responsibility make Nexperia a rewarding place to advance your career while contributing to cutting-edge technologies in the semiconductor industry.
