Nexperia is seeking a Principal Package Competence Engineer to drive advanced packaging for Power MOSFETs. You will lead package design studies, supervise industrialization, and coordinate with product lines, assembly sites, and R&D to shape the roadmap and maintain technology leadership.
The role requires deep expertise in semiconductor packaging, DOE, and data-driven problem solving, with a track record of innovation and stakeholder engagement.
#J-18808-Ljbffr
Lead Semiconductor Packaging Engineer for Power MOSFETs in Manchester employer: NEXPERIA B.V.
Nexperia is an exceptional employer located in Manchester, offering a dynamic work culture that prioritises employee well-being and professional growth. With generous benefits such as 33 days of annual leave, flexible working options, and funded academic support up to PhD level, employees are empowered to thrive both personally and professionally. The company's commitment to diversity, equity, and sustainability further enhances its appeal, making it a rewarding place for those seeking meaningful employment in the electronics industry.