At a Glance
- Tasks: Lead the design of cutting-edge CPU architectures and define innovative memory strategies.
- Company: Join a leading tech firm in Cambridge, shaping the future of computing.
- Benefits: Attractive salary, flexible working options, and opportunities for professional growth.
- Other info: Dynamic team environment with a focus on innovation and collaboration.
- Why this job: Make a significant impact in AI and GPU technology while advancing your career.
- Qualifications: 15+ years in GPU or AI architecture with strong leadership skills.
The predicted salary is between 72000 - 88000 Β£ per year.
Location: Cambridge, United Kingdom
Job Type: Permanent
Salary: 130K - 160K GBP per annum DOE
Key Responsibilities:
- Define memory hierarchy strategy for converged GPU/NPU
Requirements:
- 15+ years of experience in GPU, AI accelerator, or heterogeneous compute architecture
- Deep understanding of GPU microarchitecture (SIMD/SIMT, scheduling, memory systems)
- Strong knowledge of tensor/matrix compute and AI acceleration techniques
- Proven experience delivering high-volume silicon
- Expertise in performance modelling and power analysis
- Strong cross-functional communication and leadership capability
- Experience with CPU Architecture
- Familiarity with RISC-V and/or GEM 5 would be a bonus
Chief CPU Architect employer: microTECH Global LTD
As a Senior Electronics Designer at our Luton location, you will thrive in a dynamic and innovative work culture that prioritises collaboration and creativity. We offer competitive benefits, including flexible remote/hybrid working options, and a strong commitment to employee growth through continuous learning opportunities and professional development. Join us to be part of a forward-thinking team where your contributions directly impact the success of cutting-edge technology solutions.
We think you need these skills to ace Chief CPU Architect
Memory & Interconnect Architecture
GPU Microarchitecture
SIMD/SIMT Scheduling
Memory Systems
Tensor/Matrix Compute
AI Acceleration Techniques
High-Volume Silicon Delivery