At a Glance
- Tasks: Shape next-gen optical packaging tech for AI and high-performance computing.
- Company: Join a leading tech firm at the forefront of innovation.
- Benefits: Competitive salary, flexible work options, and opportunities for professional growth.
- Other info: Collaborative environment with hands-on experience across diverse teams.
- Why this job: Make a real impact on cutting-edge technologies that drive the future.
- Qualifications: Bachelor's degree in a technical field and 5+ years in advanced packaging.
The predicted salary is between 59400 - 72600 £ per year.
In this role you will shape next-generation optical and advanced packaging technologies to enable AI infrastructure and high-performance computing. You’ll work at the crossroads of optics, electronics, packaging, and system design, translating research requirements into scalable package architectures and qualification plans. You’ll collaborate with research, Azure engineering, suppliers, and partners to move technologies from prototype to production. This is a hands-on, cross-functional role that tackles real-world constraints like yield, cost, and reliability, with a clear impact on deployable systems.
Responsibilities
- Shape next-generation optical and advanced packaging technologies for AI infrastructure and HPC
- Integrate photonic devices and electronic ICs within package architectures across thermal and mechanical domains
- Collaborate across research, engineering, sourcing, manufacturing and product teams, plus industry partners
- Drive technology progression from architecture and prototype through supplier qualification to production readiness
- Translate research and packaging innovations into scalable technologies with real-world product impact
Key requirements
- Bachelor’s degree or equivalent in a technical field and 5+ years in advanced semiconductor packaging or optical/photonics packaging
- Experience in 2.5D/3D integration, interposers/RDL, fine-pitch interconnects, die attach/bonding, underfill, moulding, adhesives, and thermal management
- Experience integrating optical/photonics devices with electronic ICs and package structures, including optical coupling, electrical interconnects, and reliability considerations
- Hands-on experience across package development lifecycle: design validation, reliability qualification, failure analysis, DFM, and manufacturing readiness
- Experience working with external manufacturers or technology partners (foundries, OSATs, suppliers)
- Collaborative mindset
- Strong problem-solving and risk-management capabilities
- Cross-functional communication and stakeholder management
- Advanced semiconductor packaging
- Optical/photonics packaging and integration
- 2.5D/3D integration, interposers/RDL
Senior/Principal Optical Packaging Engineer in Cambridge employer: Microsoft
At Microsoft, we pride ourselves on being an exceptional employer, particularly for the role of AI Business Solution Sales Manager. Our culture is rooted in innovation, inclusivity, and continuous learning, providing employees with ample opportunities for professional growth while working in a dynamic, fast-paced environment. With a strong focus on collaboration and customer success, our team members are empowered to make a meaningful impact, supported by industry-leading resources and a commitment to employee development.
