Senior Packaging Design Engineer in Caldicot

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B) global organization? We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip's nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it's won us countless awards for diversity and workplace excellence.

Microchip's Caldicot site is responsible for designing and delivering the next generation of advanced electronic module solutions for global technology markets. Our expertise lies in delivering advanced packaging solutions to our customers where small size and high reliability are critical. Some of our markets include medical, automotive, aerospace, and renewable energy. We develop a wide range of module solutions, ranging from miniaturized implant medical devices to compound semiconductor power modules.

We offer an attractive benefits package and flexible working arrangements. Microchip has a strong set of values and puts employee's continuous development and progression at its core. The site is set in a semi-rural location with free parking and is easily accessed from both the M4 and M48 motorways.

As a Packaging Design Engineer you will be required to research, design, develop and evaluate new packaging concepts, prototypes and products of the company's next generation microelectronic modules. This position will allow you to become an integral part of a team of specialists in materials, mechanical, electronics and packaging engineers that strive to push the boundaries of conventional microelectronics packaging. We are looking for an individual with a passion for exploration and breaking down barriers. If you are a lateral thinker who thrives on challenging the norm, we welcome the opportunity to speak to you.

As a member of our R&D team, you will contribute to the growth and continued success of the company, through the successful development of our next generation products and technology solutions. This role may be suitable to experienced process/product engineers looking to make the transition to a design role, using their practical experience to improve on current packaging techniques.

• Research new technology, processes and materials to drive innovation in semiconductor packaging
• Developing new packaging processes, concepts and performing validation to ensure quality performance criteria is achieved.
• Working with multi-disciplined engineering team to deliver semiconductor packaging roadmaps
• Responsible for managing projects and providing technical input to wider engineering teams
• Interpret customer requirements and support new product proposals
• Travel internationally on occasion as requested.
• Carry out key design decisions for reliability and manufacturability of new product subject to harsh environments - temperature, pressure, vibration etc

• Bachelor's, Master's Degree or PhD in relevant engineering discipline
• Minimum of 3 years' experience working in a similar role
• Experience of the following areas desirable: RF, high power and optical packaging
• Experience in the following manufacturing disciplines: SMT, die attach, encapsulation, wire bond and flip chip. Knowledge of Silver Sintering and Transfer moulding desirable.
• Experience conducting environmental stress screening (ESS) for validation purposes
• Familiar with a variety of failure analysis capabilities including – CSAM, X-Ray, Microsectional Analysis, Decapsulation, Ball and Die shear, and Bond pull
• Interpersonal and communication skills
• Experience working with cross-functional teams
• Self-motivating, proactive and results driven approach
• Problem-solving and root cause identification skills
• Able to work to deadlines with good quality
• Demonstrated ability to conduct independent research

Travel Time: 0% - 25%