Principal Test Engineer – Advanced Packaging in Caldicot

Principal Test Engineer – Advanced Packaging in Caldicot

Caldicot Full-Time 60000 - 80000 £ / year (est.) No working from home possible
Microchip Technology Inc.

At a Glance

  • Tasks: Lead test strategies and develop advanced test systems for next-gen electronic modules.
  • Company: Join Microchip's innovative Advanced Packaging team pushing the boundaries of microelectronics.
  • Benefits: Competitive salary, career growth, and a collaborative work environment.
  • Other info: Opportunity to influence product development and work with cutting-edge technology.
  • Why this job: Shape the future of electronics while solving complex challenges in a dynamic setting.
  • Qualifications: Degree in Electrical/Electronic Engineering and experience in test engineering required.

The predicted salary is between 60000 - 80000 £ per year.

Microchip’s Advanced Packaging team delivers competitive advantage by enabling the next generation of highly integrated, miniaturised electronic solutions. By combining expertise across materials, mechanical, electronics and packaging disciplines, the team pushes the boundaries of what is possible in modern microelectronics. As a Principal Test Engineer, you will play a critical role in the design, development and industrialisation of next-generation electronic modules. You will shape test strategy, drive technical direction, and collaborate across a multi-disciplinary environment to deliver robust, scalable and high-performance solutions. We are seeking a technically curious and forward-thinking engineer who thrives in solving complex challenges and influencing innovative product development.

Key Responsibilities

  • Define and lead test strategies to enable efficient, high-quality product verification and validation
  • Translate customer and product requirements into clear, robust test specifications
  • Architect and develop advanced test systems (hardware and software), including rack-based and embedded solutions
  • Drive data analysis and interpretation to validate performance against application requirements
  • Lead risk management activities (e.g. FMEA) and ensure compliance across development programmes
  • Champion continuous improvement, including measurement systems analysis and test optimisation
  • Collaborate across engineering disciplines to communicate results, influence decisions and solve complex problems

Qualifications

  • Degree (or equivalent) in Electrical/Electronic Engineering or related discipline
  • Proven experience in a senior/principal test engineering role within a complex engineering environment
  • Strong application development expertise in Visual Basic and Visual C# is essential
  • Experience with embedded systems and communication protocols (UART, SPI, I2C)
  • Knowledge of test hardware design, including NI-based systems and custom test platforms
  • Circuit design and PCB layout design using software such as Altium is desirable
  • Strong project leadership skills with the ability to drive programmes and influence stakeholders
  • Structured, analytical and commercially aware, with excellent communication and problem-solving skills

Travel Time: 0% - 25%

Principal Test Engineer – Advanced Packaging in Caldicot employer: Microchip Technology Inc.

Microchip Technology Inc. is an exceptional employer that fosters a culture of innovation and collaboration, making it an ideal place for a Principal Test Engineer to thrive. With a commitment to employee growth, the company offers extensive training opportunities and encourages creative problem-solving in a multi-disciplinary environment. Located in a dynamic tech hub, employees benefit from a vibrant work atmosphere and the chance to contribute to cutting-edge advancements in microelectronics.

Microchip Technology Inc.

Contact Details:

Microchip Technology Inc. Recruitment Team

StudySmarter Expert Advice🤫

We think this is how you could land Principal Test Engineer – Advanced Packaging in Caldicot

Join Engineering Meetups!

Get yourself along to local engineering meetups or tech conferences. These are great places to connect with like-minded folks and industry leaders who might just have a lead on that full-time Principal Test Engineer – Advanced Packaging role you’re after at Microchip Technology Inc..

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Apply Through Company Websites

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We think you need these skills to ace Principal Test Engineer – Advanced Packaging in Caldicot

Test Strategy Development
Technical Direction
Multi-disciplinary Collaboration
Test Specification Translation
Advanced Test Systems Development
Data Analysis and Interpretation
Risk Management (FMEA)

Some tips for your application 🫡

Showcase Your Technical Expertise:When applying for an engineering role like Principal Test Engineer – Advanced Packaging, it’s essential to highlight your technical skills. Include any relevant software or tools you're proficient in on your CV—think CAD software, simulation tools, or programming languages. Don't skimp on any engineering projects you've worked on that demonstrate your ability to solve complex problems.

Focus on Results and Impact:In the engineering world, we love numbers and real-world impact. Quantify your achievements wherever possible—like reducing costs by a certain percentage, improving efficiency, or successfully completing a project ahead of schedule. This gives your future employers at Microchip Technology Inc. a clear picture of the value you can bring.

Craft a Compelling Cover Letter:Use your cover letter to express your passion for engineering and explain why you’re drawn to Microchip Technology Inc. specifically. Share what aspects of their work excite you and how your values align with theirs. This is your chance to show a bit of personality while keeping it professional!

Include Relevant Certifications:If you have any engineering certifications, especially ones that are recognised in your field, make sure to feature them prominently on your CV. They demonstrate not just your knowledge, but also your commitment to professional development, which is something we at StudySmarter value highly.

How to prepare for a job interview at Microchip Technology Inc.

Brush Up on Core Engineering Principles

Before heading into the interview with Microchip Technology Inc., make sure you're solid on the fundamental engineering principles relevant to the role. Be ready to discuss concepts such as thermodynamics, fluid mechanics, or structural analysis, depending on the specifics mentioned in the job description. Don’t skip any hands-on projects or coursework; these can be excellent talking points!

Show Off Your Problem-Solving Skills

Expect technical questions or case studies during your interview—after all, engineering is all about solving problems! Prepare a few examples of how you've tackled engineering challenges in the past, whether at university or in any practical experience. Practising with mock technical interviews can really help you articulate your thought process and solutions.

Relate Your Experience to the Role

In a full-time role, employers like Microchip Technology Inc. want to see that you can adapt and grow within their team. Be ready to discuss how your previous internships, projects, or studies relate directly to the work you'll be doing. Highlight specific experiences that showcase your collaborative skills and how you've successfully worked within a team environment.

Know Your Tools and Software

Most engineering roles require familiarity with specific tools and software. Prepare to talk about your proficiency with programmes like AutoCAD, MATLAB, or SolidWorks if they’re relevant to the role. Even better, have examples of projects where you’ve used these tools, as it'll demonstrate your hands-on experience and readiness for the job.