At a Glance
- Tasks: Join us as a Manufacturing Technician, operating wire bonding machines and ensuring top-notch product quality.
- Company: Microchip Technology is a global leader in technology, empowering innovation with a diverse team of 20,000 members.
- Benefits: Enjoy a supportive culture, career growth programs, and a commitment to employee development.
- Why this job: Be part of a multi-billion dollar company that values trust, respect, and community while working on cutting-edge technology.
- Qualifications: Must have a high school diploma and 2 years of experience in wire bonding or semiconductor manufacturing.
- Other info: Candidates must be 18+, and this role requires adherence to safety protocols and cleanroom standards.
The predicted salary is between 30000 - 42000 £ per year.
Are you looking for a unique opportunity to be a part of something great? Want to join a 20,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology, Inc.
People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip\’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it\’s won us countless awards for diversity and workplace excellence.
Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.
Visit our careers page to see what exciting opportunities and company perks await!
Job Description:
We are seeking a detail-oriented and technically skilled Manufacturing Technician – Wire Bonder to join our Discrete Products Group (DPG) component manufacturing department. The ideal candidate will have experience in automatic or manual aluminum wire bonding techniques and semiconductor manufacturing processes. You will play a crucial role in the production of our high-quality electronic components, ensuring that our products meet the highest standards.
ESSENTIAL DUTIES AND JOB RESPONSIBILITIES include the following.
- Operate wire bonding machines and equipment with precision and according to standard operating procedures.
- Perform manual wire bonding tasks as needed, utilizing microscopes and bonding tools.
- Inspect and test wire bonds to ensure quality and compliance with specifications.
- Perform wire bond equipment setup including tool changes, wire changes, and
- Troubleshoot wire bond equipment and process issues, implementing corrective actions to minimize downtime.
- Maintain accurate records of production data, process adjustments, and equipment maintenance.
- Collaborate with engineering and quality assurance teams to improve wire bonding processes and product quality.
- Adhere to cleanroom protocols and safety guidelines to maintain a safe and efficient work environment.
- Participate in continuous improvement initiatives and training programs to enhance technical skills and knowledge.
- Assist in the training of new technicians and support staff as required
- Perform other tasks and assist with various projects as needed.
- Good computer skills are required to support retrieval of drawings and work instructions as well as other job activities.
- Good interpersonal, teaming and communication skills
Requirements/Qualifications:
* Ability to multi-task while paying careful attention to detail
* Prior success working both individually and in a team environment
* Good written and verbal communication skills
* Ability to follow written and verbal direction
* Ability to read, comprehend and follow detailed work specifications
* Excellent listening skills
* Adaptability to frequent change and improvements
* Regular and predictable attendance is essential
* Ability to wear the required Protective Equipment
* Basic computer, math and reading comprehension skills
* You must be 18 years old with a high school diploma or GED
Required Qualifications:
- High school diploma or equivalent; technical degree or certification in electronics, microelectronics, or a related field is preferred.
- Minimum of 2 years of experience in a wire bonding or semiconductor manufacturing role.
- Proficiency with automated wire bonding machinery and manual wire bonding techniques.
- Strong understanding of microelectronics and the ability to work with delicate components.
- Ability to read and interpret technical drawings and process specifications.
- Excellent manual dexterity and hand-eye coordination
- Excellent visual capability to work with extremely small die, without magnification devices.
- Experience using tweezers, vacuum pencils, etc.
- Strong problem-solving skills and attention to detail.
- Ability to work in a fast-paced, team-oriented environment.
- Good communication skills, both written and verbal.
U.S. Export Controls Requirements: This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).
Travel Time:
0% – 25%
Physical Attributes:
Carrying, Crouching, Feeling, Foot Controls, Handling, Hearing, Kneeling, Lifting, Noise and/or vibration, Other, Pulling, Pushing, Reaching, Seeing, Stooping, Talking, Works Alone, Works Around Others
Physical Requirements:
Able to lift, push, pull 25 lbs; carry 15 lbs; sit 10%; stand 60%; walk 40%; must be able to perform activities that include stooping, reaching, handling, hearing, talking, seeing, working alone and working around others.
Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.
For more information on applicable equal employment regulations, please refer to the EEO is the Law Poster and the EEO is the Law Poster Supplement. Please also refer to the Pay Transparency Policy Statement.
To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.
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Manufacturing Technician - Wire Bonding employer: Microchip Technology Inc
Contact Detail:
Microchip Technology Inc Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land Manufacturing Technician - Wire Bonding
✨Tip Number 1
Familiarise yourself with wire bonding techniques and semiconductor manufacturing processes. Understanding the technical aspects of the role will not only boost your confidence but also help you engage in meaningful conversations during interviews.
✨Tip Number 2
Network with current or former employees of Microchip Technology, especially those in similar roles. They can provide valuable insights into the company culture and expectations, which can be a great advantage when preparing for your interview.
✨Tip Number 3
Demonstrate your problem-solving skills by preparing examples of past experiences where you successfully tackled challenges in a manufacturing environment. This will show your potential employer that you can handle the fast-paced nature of the job.
✨Tip Number 4
Stay updated on the latest trends and technologies in microelectronics and wire bonding. Showing that you are proactive about your professional development can set you apart from other candidates and demonstrate your commitment to the field.
We think you need these skills to ace Manufacturing Technician - Wire Bonding
Some tips for your application 🫡
Tailor Your CV: Make sure to customise your CV to highlight relevant experience in wire bonding and semiconductor manufacturing. Use keywords from the job description to demonstrate that you meet the specific requirements.
Craft a Compelling Cover Letter: Write a cover letter that showcases your passion for technology and your understanding of Microchip Technology's values. Mention how your skills align with their mission and how you can contribute to their team.
Highlight Technical Skills: In your application, emphasise your proficiency with automated wire bonding machinery and manual techniques. Provide examples of how you've successfully used these skills in previous roles.
Showcase Teamwork and Communication: Since the role requires collaboration with engineering and quality assurance teams, include examples of your teamwork and communication skills. Highlight any experiences where you contributed to process improvements or training new staff.
How to prepare for a job interview at Microchip Technology Inc
✨Showcase Your Technical Skills
Make sure to highlight your experience with wire bonding techniques and semiconductor manufacturing processes. Be prepared to discuss specific examples of how you've operated wire bonding machines and handled manual tasks, as this will demonstrate your technical proficiency.
✨Emphasise Attention to Detail
Given the nature of the role, it's crucial to convey your ability to pay attention to detail. Share instances where your meticulousness led to successful outcomes, especially in quality assurance or troubleshooting scenarios.
✨Demonstrate Team Collaboration
Microchip values teamwork, so be ready to discuss your experiences working in a team environment. Highlight how you’ve collaborated with engineering and quality assurance teams to improve processes and product quality.
✨Prepare for Problem-Solving Questions
Expect questions that assess your problem-solving skills. Think of specific challenges you've faced in previous roles, particularly related to equipment issues or process improvements, and how you resolved them effectively.