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- Tasks: Lead the development of next-gen 2.5D and 3D semiconductor packaging technologies.
- Company: Innovative company at the forefront of semiconductor technology.
- Benefits: Competitive salary, generous pension, annual bonus, and private medical cover.
- Why this job: Shape the future of AI applications with cutting-edge packaging solutions.
- Qualifications: Strong experience in semiconductor package design and leadership skills.
- Other info: Exciting opportunity for strategic thinkers in a dynamic environment.
The predicted salary is between 48000 - 72000 £ per year.
My client is looking to lead the development of next-generation 2.5D and 3D packaging technologies.
What you’ll do:
- Architect innovative 2.5D/3D packaging solutions from concept to prototype.
- Lead advanced packaging R&D programmes and technology roadmaps.
- Oversee design, assembly, test, and validation of complex semiconductor packages.
- Collaborate across teams to solve system-level packaging challenges.
- Represent the company in technical discussions, bids, and industry forums.
What we’re looking for:
- Strong experience in semiconductor package design and development (3D/2.5D).
- Proven track record leading microelectronics packaging projects.
- Deep understanding of design, modelling, and validation processes.
- Excellent communication, leadership, and problem-solving skills.
Benefits:
- Competitive salary
- 15% pension (10% employer)
- Annual bonus
- Private medical cover extended to family
- Sponsorship with up to £5000 in relocation fees
If you’re looking for a strategic, hands-on role aimed at defining and delivering next-generation packaging for AI applications, contact Ella Flynn at IC Resources.
Principal Packaging Engineer - IC Resources in Newport employer: Jobster
Contact Detail:
Jobster Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land Principal Packaging Engineer - IC Resources in Newport
✨Tip Number 1
Network like a pro! Reach out to industry contacts and attend relevant events. We can’t stress enough how important it is to make connections that could lead to job opportunities.
✨Tip Number 2
Showcase your expertise! Create a portfolio or presentation that highlights your experience in semiconductor packaging. This will help you stand out during interviews and discussions.
✨Tip Number 3
Prepare for technical discussions! Brush up on the latest trends in 2.5D and 3D packaging technologies. We want you to be ready to impress with your knowledge and insights.
✨Tip Number 4
Apply through our website! It’s the best way to ensure your application gets noticed. Plus, we’re always looking for passionate individuals who want to shape the future of packaging technology.
We think you need these skills to ace Principal Packaging Engineer - IC Resources in Newport
Some tips for your application 🫡
Tailor Your CV: Make sure your CV is tailored to highlight your experience in semiconductor packaging design and development. We want to see how your skills align with the role, so don’t be shy about showcasing your achievements in 2.5D and 3D packaging technologies!
Craft a Compelling Cover Letter: Your cover letter is your chance to shine! Use it to explain why you’re the perfect fit for this role. Talk about your leadership experience in microelectronics projects and how you’ve tackled system-level packaging challenges in the past.
Showcase Your Communication Skills: Since excellent communication is key for this role, make sure your application reflects that. Use clear and concise language, and don’t forget to mention any experience you have representing your company in technical discussions or industry forums.
Apply Through Our Website: We encourage you to apply directly through our website. It’s the best way for us to receive your application and ensures you don’t miss out on any important updates regarding your application status!
How to prepare for a job interview at Jobster
✨Know Your Packaging Tech
Make sure you brush up on the latest trends in 2.5D and 3D packaging technologies. Be ready to discuss specific projects you've worked on, showcasing your experience in semiconductor package design and development.
✨Showcase Leadership Skills
Prepare examples that highlight your leadership in microelectronics packaging projects. Think about times when you led a team or drove a project forward, and be ready to share these stories during the interview.
✨Communicate Clearly
Since excellent communication is key for this role, practice articulating complex ideas simply. You might be asked to explain technical concepts, so ensure you can convey your thoughts clearly and confidently.
✨Collaborate and Problem-Solve
Be prepared to discuss how you've collaborated across teams to tackle system-level packaging challenges. Think of specific instances where your problem-solving skills made a difference, and be ready to share those insights.
