Technical Lead - Back-end Physical Design (CDI)
Technical Lead - Back-end Physical Design (CDI)

Technical Lead - Back-end Physical Design (CDI)

Full-Time 66000 - 88000 £ / year (est.) No home office possible
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At a Glance

  • Tasks: Lead back-end physical design processes for cutting-edge ICs and mentor teams.
  • Company: Join a pioneering semiconductor company specialising in advanced mixed-signal SoC solutions.
  • Benefits: Enjoy a competitive salary, remote work options, and a rewarding referral scheme.
  • Why this job: Be at the forefront of innovation in IC design and make a real impact.
  • Qualifications: Expertise in physical design, RTL-to-GDSII flow, and scripting languages like Python or TCL required.
  • Other info: Opportunity to work remotely within France and contribute to exciting technology advancements.

The predicted salary is between 66000 - 88000 £ per year.

Technical Lead – Back-end Physical Design (CDI)Location: Paris or Caen (preference) or 100% remote within FranceSalary: Package up to €110,000 Gross Per Annum + Company BenefitsAre you looking to be at the forefront of advanced IC design?What about an opportunity to join a specialist in cutting-edge mixed-signal and SoC solutions?A pioneering semiconductor company, at the forefront of advanced integrated circuit design, specializing in cutting-edge mixed-signal SoC solutions, is looking for a technical leader to play a key role in the definition, implementation, and supervision of state-of-the-art physical designs.As a Technical Lead in Back-end Physical Design, you will play a crucial role in defining, implementing, and supervising the back-end design methodology and flow. Acting as the technical mentor and domain expert, you\’ll work closely with product teams and customers, ensuring the quality and integrity of designs through all stages of the development lifecycle.You will be responsible for maintaining best practices in physical design, overseeing the delivery of very complex multi-hierarchy low-power ICs, and driving innovation within advanced technology nodes.Key Responsibilities:Lead the methodology and implementation of back-end physical design processes for digital and analog/mixed-signal SoCsEnsure seamless collaboration and hand-off between digital, front-end, and analog layout teamsDrive technical reviews, provide mentorship, and ensure comprehensive documentation of deliverablesDeliver full-chip and IP-level physical design including synthesis, floorplanning, place & route, timing analysis, and physical verificationYour background:Expert knowledge in physical design with proven tape-out experienceExtensive understanding of RTL-to-GDSII flow and process nodes like FDSOI and FinFETDeep understanding of low-power design methodologies, e.g., Power Gating, Multi-Voltage domains, and UPF/CPFStrong background in logic synthesis, static timing analysis, floorplanning, power grid planning, and physical verificationAdvanced knowledge of Python/TCL or Perl for scriptingNote: 5V Tech is acting as an Employment Agency for this vacancy. We offer a reward scheme if you recommend someone for this position, up to €250 for you and an additional €250 to a charity of your choice. 5V Tech is recognized as a talent solutions expert within IoT and Deep Technology across Europe, the UK, and North America. #J-18808-Ljbffr

Technical Lead - Back-end Physical Design (CDI) employer: JobLeads GmbH

Join a pioneering semiconductor company in Paris or Caen, where innovation meets expertise in advanced IC design. With a strong focus on employee growth and a collaborative work culture, we offer competitive salaries and benefits, alongside opportunities to lead cutting-edge projects in mixed-signal SoC solutions. Embrace the chance to mentor others while working in a dynamic environment that values creativity and technical excellence.
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Contact Detail:

JobLeads GmbH Recruiting Team

StudySmarter Expert Advice 🤫

We think this is how you could land Technical Lead - Back-end Physical Design (CDI)

✨Tip Number 1

Familiarise yourself with the latest trends in back-end physical design, especially in mixed-signal and SoC solutions. This knowledge will not only help you during interviews but also demonstrate your passion for the field.

✨Tip Number 2

Network with professionals in the semiconductor industry, particularly those who have experience in physical design. Engaging with them can provide insights into the company culture and expectations, which can be invaluable during your application process.

✨Tip Number 3

Prepare to discuss specific projects where you've led back-end physical design processes. Highlight your role in driving innovation and maintaining best practices, as this aligns closely with the responsibilities of the Technical Lead position.

✨Tip Number 4

Brush up on your scripting skills in Python, TCL, or Perl. Being able to demonstrate your technical proficiency in these areas can set you apart from other candidates and show that you're ready to hit the ground running.

We think you need these skills to ace Technical Lead - Back-end Physical Design (CDI)

Expert knowledge in physical design
Proven tape-out experience
Extensive understanding of RTL-to-GDSII flow
FDSOI and FinFET process nodes knowledge
Low-power design methodologies expertise
Power Gating and Multi-Voltage domains understanding
UPF/CPF knowledge
Strong background in logic synthesis
Static timing analysis skills
Floorplanning expertise
Power grid planning experience
Physical verification knowledge
Advanced Python/TCL or Perl scripting skills
Technical mentorship abilities
Documentation and communication skills

Some tips for your application 🫡

Tailor Your CV: Make sure your CV highlights your expertise in physical design and relevant experience with RTL-to-GDSII flow. Emphasise any proven tape-out experience and your understanding of low-power design methodologies.

Craft a Compelling Cover Letter: Write a cover letter that showcases your passion for advanced IC design and your leadership skills. Mention specific projects where you led teams or drove innovation, and how these experiences align with the role's responsibilities.

Highlight Technical Skills: In your application, clearly list your technical skills, especially in Python/TCL or Perl scripting. Provide examples of how you've used these skills in past projects to enhance physical design processes.

Showcase Collaboration Experience: Demonstrate your ability to work collaboratively with cross-functional teams. Include examples of how you've ensured seamless hand-offs between digital, front-end, and analog layout teams in previous roles.

How to prepare for a job interview at JobLeads GmbH

✨Showcase Your Technical Expertise

As a Technical Lead, it's crucial to demonstrate your deep understanding of physical design and the RTL-to-GDSII flow. Be prepared to discuss specific projects where you've successfully implemented methodologies and how you tackled challenges in low-power design.

✨Prepare for Technical Questions

Expect in-depth technical questions related to your experience with FDSOI and FinFET process nodes. Brush up on your knowledge of logic synthesis, static timing analysis, and physical verification to confidently answer any queries that may arise.

✨Emphasise Collaboration Skills

Highlight your ability to work seamlessly with cross-functional teams, especially between digital, front-end, and analog layout teams. Share examples of how you've facilitated collaboration and ensured smooth hand-offs in previous roles.

✨Demonstrate Leadership and Mentorship

As a technical mentor, it's important to convey your leadership style. Discuss how you've guided junior team members, conducted technical reviews, and maintained comprehensive documentation. This will show your potential employer that you're ready to take on a leadership role.

Technical Lead - Back-end Physical Design (CDI)
JobLeads GmbH
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  • Technical Lead - Back-end Physical Design (CDI)

    Full-Time
    66000 - 88000 £ / year (est.)

    Application deadline: 2027-08-31

  • J

    JobLeads GmbH

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