Manufacturing Technician - Wire Bonding
Manufacturing Technician - Wire Bonding

Manufacturing Technician - Wire Bonding

Full-Time 30000 - 42000 £ / year (est.) No home office possible
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At a Glance

  • Tasks: Join us as a Manufacturing Technician, operating wire bonding machines and ensuring top-notch product quality.
  • Company: Microchip Technology is a global leader in technology, empowering innovation with a diverse team of 20,000 members.
  • Benefits: Enjoy a supportive culture, career growth programs, and a commitment to employee development.
  • Why this job: Be part of a multi-billion dollar company that values trust, respect, and community while working on cutting-edge technology.
  • Qualifications: High school diploma required; 2 years in wire bonding or semiconductor manufacturing preferred.
  • Other info: Candidates must be 18+ and able to meet physical requirements; strong problem-solving skills are essential.

The predicted salary is between 30000 - 42000 £ per year.

Are you looking for a unique opportunity to be a part of something great? Want to join a 20,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology, Inc.People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip\’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it\’s won us countless awards for diversity and workplace excellence.Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.Visit our careers page to see what exciting opportunities and company perks await!Job Description:We are seeking a detail-oriented and technically skilled Manufacturing Technician – Wire Bonder to join our Discrete Products Group (DPG) component manufacturing department. The ideal candidate will have experience in automatic or manual aluminum wire bonding techniques and semiconductor manufacturing processes. You will play a crucial role in the production of our high-quality electronic components, ensuring that our products meet the highest standards.ESSENTIAL DUTIES AND JOB RESPONSIBILITIES include the following.Operate wire bonding machines and equipment with precision and according to standard operating procedures.Perform manual wire bonding tasks as needed, utilizing microscopes and bonding tools.Inspect and test wire bonds to ensure quality and compliance with specifications.Perform wire bond equipment setup including tool changes, wire changes, andTroubleshoot wire bond equipment and process issues, implementing corrective actions to minimize downtime.Maintain accurate records of production data, process adjustments, and equipment maintenance.Collaborate with engineering and quality assurance teams to improve wire bonding processes and product quality.Adhere to cleanroom protocols and safety guidelines to maintain a safe and efficient work environment.Participate in continuous improvement initiatives and training programs to enhance technical skills and knowledge.Assist in the training of new technicians and support staff as requiredPerform other tasks and assist with various projects as needed.Good computer skills are required to support retrieval of drawings and work instructions as well as other job activities.Good interpersonal, teaming and communication skillsRequirements/Qualifications:* Ability to multi-task while paying careful attention to detail* Prior success working both individually and in a team environment* Good written and verbal communication skills* Ability to follow written and verbal direction* Ability to read, comprehend and follow detailed work specifications* Excellent listening skills* Adaptability to frequent change and improvements* Regular and predictable attendance is essential* Ability to wear the required Protective Equipment* Basic computer, math and reading comprehension skills* You must be 18 years old with a high school diploma or GEDRequired Qualifications:High school diploma or equivalent; technical degree or certification in electronics, microelectronics, or a related field is preferred.Minimum of 2 years of experience in a wire bonding or semiconductor manufacturing role.Proficiency with automated wire bonding machinery and manual wire bonding techniques.Strong understanding of microelectronics and the ability to work with delicate components.Ability to read and interpret technical drawings and process specifications.Excellent manual dexterity and hand-eye coordinationExcellent visual capability to work with extremely small die, without magnification devices.Experience using tweezers, vacuum pencils, etc.Strong problem-solving skills and attention to detail.Ability to work in a fast-paced, team-oriented environment.Good communication skills, both written and verbal.U.S. Export Controls Requirements: This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).Travel Time:0% – 25%Physical Attributes:Carrying, Crouching, Feeling, Foot Controls, Handling, Hearing, Kneeling, Lifting, Noise and/or vibration, Other, Pulling, Pushing, Reaching, Seeing, Stooping, Talking, Works Alone, Works Around OthersPhysical Requirements:Able to lift, push, pull 25 lbs; carry 15 lbs; sit 10%; stand 60%; walk 40%; must be able to perform activities that include stooping, reaching, handling, hearing, talking, seeing, working alone and working around others.Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.For more information on applicable equal employment regulations, please refer to the EEO is the Law Poster and the EEO is the Law Poster Supplement. Please also refer to the Pay Transparency Policy Statement.To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes. #J-18808-Ljbffr

Manufacturing Technician - Wire Bonding employer: JobLeads GmbH

Microchip Technology, Inc. is an exceptional employer that fosters a culture of trust, empowerment, and respect within its diverse workforce of 20,000 members. With a strong commitment to employee development through nationally-recognised Leadership Passage Programs, team members enjoy unlimited career potential while contributing to cutting-edge technology that powers the world. Located in a dynamic environment, employees benefit from a collaborative atmosphere that encourages innovation and continuous improvement, making it a rewarding place to grow both personally and professionally.
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Contact Detail:

JobLeads GmbH Recruiting Team

StudySmarter Expert Advice 🤫

We think this is how you could land Manufacturing Technician - Wire Bonding

✨Tip Number 1

Familiarise yourself with wire bonding techniques and semiconductor manufacturing processes. Understanding the technical aspects of the role will not only boost your confidence but also help you engage in meaningful conversations during interviews.

✨Tip Number 2

Network with current or former employees of Microchip Technology, especially those in similar roles. They can provide valuable insights into the company culture and expectations, which can be a great advantage when preparing for your interview.

✨Tip Number 3

Demonstrate your problem-solving skills by preparing examples of past experiences where you successfully tackled challenges in a manufacturing environment. This will show your potential employer that you can handle the fast-paced nature of the job.

✨Tip Number 4

Stay updated on the latest trends and technologies in microelectronics. Showing your enthusiasm for continuous learning and improvement can set you apart from other candidates and align with Microchip's commitment to innovation.

We think you need these skills to ace Manufacturing Technician - Wire Bonding

Wire Bonding Techniques
Semiconductor Manufacturing Processes
Precision Equipment Operation
Manual Dexterity
Visual Inspection Skills
Technical Drawing Interpretation
Problem-Solving Skills
Attention to Detail
Collaboration with Engineering Teams
Cleanroom Protocol Adherence
Continuous Improvement Participation
Training and Mentoring Skills
Basic Computer Skills
Effective Communication Skills
Adaptability to Change

Some tips for your application 🫡

Tailor Your CV: Make sure to customise your CV to highlight relevant experience in wire bonding and semiconductor manufacturing. Emphasise any specific skills or techniques you possess that align with the job description.

Craft a Compelling Cover Letter: Write a cover letter that showcases your passion for technology and your understanding of Microchip Technology's values. Mention how your background and skills make you a perfect fit for the Manufacturing Technician role.

Highlight Technical Skills: In your application, clearly outline your proficiency with automated wire bonding machinery and manual techniques. Include any certifications or technical degrees that are relevant to the position.

Showcase Problem-Solving Abilities: Provide examples in your application that demonstrate your problem-solving skills and attention to detail. This could include specific challenges you've faced in previous roles and how you overcame them.

How to prepare for a job interview at JobLeads GmbH

✨Showcase Your Technical Skills

Make sure to highlight your experience with wire bonding techniques and semiconductor manufacturing processes. Be prepared to discuss specific examples of how you've operated wire bonding machines and handled manual tasks, as this will demonstrate your technical proficiency.

✨Emphasise Attention to Detail

Given the nature of the role, it's crucial to convey your ability to pay attention to detail. Share instances where your meticulousness led to successful outcomes, especially in quality assurance or troubleshooting scenarios.

✨Demonstrate Team Collaboration

Microchip values teamwork, so be ready to discuss your experiences working in a team environment. Highlight how you’ve collaborated with engineering and quality assurance teams to improve processes and product quality.

✨Prepare for Problem-Solving Questions

Expect questions that assess your problem-solving skills. Think of specific challenges you've faced in previous roles, particularly related to equipment issues or process improvements, and how you resolved them effectively.

Manufacturing Technician - Wire Bonding
JobLeads GmbH
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  • Manufacturing Technician - Wire Bonding

    Full-Time
    30000 - 42000 £ / year (est.)

    Application deadline: 2027-08-16

  • J

    JobLeads GmbH

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