Overview
In this leadership role, you will set and drive the packaging strategy for GaN power devices, shaping high-density, high-performance packages. You will lead a cross-functional team, collaborate with overseas manufacturing partners, and influence roadmap decisions aligned with the company’s growth in advanced power packaging. You will tackle design-for-manufacture, reliability, and thermal challenges to deliver right-first-time solutions. This is a strategic role at scale, blending technical depth with people leadership to advance state-of-the-art packaging. You will work closely with internal teams and external partners to push the technology envelope and impact product performance.
Responsibilities
- Lead design and development of high-performance, high-density packages for GaN power products
- Develop technologies including wirebond, flip-chip, embedded packaging and wafer back-end processes
- Balance electrical, thermal, mechanical, cost, quality and form-factor requirements
- Manage packaging development with overseas assembly houses and technology suppliers
- Support package verification, qualification, reliability and thermal testing
- Drive design-for-manufacture, processes and tools for right-first-time designs
- Conduct first-article inspection and failure analysis
- Provide packaging expertise to Applications Engineering and customers
- Contribute to product and technology roadmap
- Build external networks and stay abreast of state-of-the-art packaging
Key requirements
- Degree or higher in Engineering, Physics, Materials Science or related discipline
- Experience in designing and manufacturing high-volume semiconductor power packages, including overseas assembly houses
- Deep knowledge of packaging technologies: die attach, Ag-sintering, flip-chip, wire bonding, copper clip, PCB embedding, chip metallisation
- Strong 3D CAD experience and knowledge of supplier design rules/DFM
- 3D multiphysics/FEA simulation experience (COMSOL, ANSYS or equivalent)
- Thermal characterization of semiconductor packages
- Package qualification/reliability testing experience (TCoB, MSL, TC, HAST, HTS) against standards
- Cross-functional leadership and supplier-management skills
- Ability to manage priorities independently and deliver results
- Confident presenting technical results to internal and external stakeholders
- cross-functional collaboration
- supplier management
- effective communication
- die attach
- Ag-sintering
- flip-chip
Director of Semiconductor Packaging employer: Intellectual Capital Resources
Join a dynamic team where innovation meets collaboration, as we empower our Opto Mechanical Engineers to transform cutting-edge optical concepts into tangible products. Our supportive work culture fosters continuous learning and professional growth, with hands-on opportunities in a state-of-the-art laboratory environment. Located in a vibrant area, we offer competitive benefits and a chance to work alongside industry experts, making this an ideal place for those seeking meaningful and rewarding employment.
Contact Details:
Intellectual Capital Resources Recruitment Team
