A growing semiconductor client is currently seeking a Director of Semiconductor Packaging to lead the development of advanced, high-performance packaging solutions for GaN power semiconductors.
The role combines technical leadership, people leadership and hands-on engineering. The successful candidate will set the packaging strategy, build team capability, influence company-wide decisions and work closely with internal teams and external packaging/manufacturing partners.
Key Responsibilities
Lead the design and development of high-performance, high-density semiconductor packages for GaN power products
Develop technologies including wirebond, flip-chip, embedded packaging and wafer back-end processes
Balance electrical, thermal, mechanical, cost, quality and form-factor requirements
Lead packaging development with overseas assembly houses and technology suppliers
Support package verification, qualification, reliability and thermal testing
Drive design-for-manufacture, design processes and engineering tools to achieve right-first-time designs
Conduct first-article inspection and failure analysis
Provide packaging expertise to Applications Engineering and customers
Contribute significantly to the product and technology roadmap
Build external networks and maintain awareness of state-of-the-art semiconductor packaging
Essential Experience & Skills
Degree or higher in Engineering, Physics, Materials Science or a related discipline
Strong experience designing and manufacturing high-volume semiconductor power packages, including working with overseas assembly houses
Deep knowledge of packaging technologies including:
Die attach / Ag-sintering
Flip-chip
Wire bonding
Copper clip
PCB embedding
Chip metallisation
Strong 3D CAD experience and knowledge of supplier design rules/DFM
Strong 3D multiphysics/FEA simulation experience using tools such as COMSOL, ANSYS or equivalent
Experience with thermal characterisation of semiconductor packages
Experience with package qualification/reliability testing, including TCoB, MSL, TC, HAST and HTS, against relevant standards
Strong cross-functional leadership and supplier-management skills
Ability to manage priorities independently and deliver results
Confident presenting technical results to internal and external stakeholders
Please contact Rachel Anderson for further details.
Director of Semiconductor Packaging in Cambridge employer: Intellectual Capital Resources
Join a dynamic team where innovation meets collaboration, as we empower our Opto Mechanical Engineers to transform cutting-edge optical concepts into tangible products. Our supportive work culture fosters continuous learning and professional growth, with hands-on opportunities in a state-of-the-art laboratory environment. Located in a vibrant area, we offer competitive benefits and a chance to work alongside industry experts, making this an ideal place for those seeking meaningful and rewarding employment.
Contact Details:
Intellectual Capital Resources Recruitment Team
