My client is looking for a Principal Packaging Engineer, focused on advanced packaging architecture, heterogeneous integration and next-generation semiconductor systems across AI, HPC, RF, power and photonics. This is an opportunity for an Engineer with a strong technical background, and leadership experience, looking to step into a Principal position.
The information below covers the role requirements, expected candidate experience, and accompanying qualifications.
Responsibilities
Architect advanced 2.5D/3D packaging and heterogeneous integration solutions
Lead chiplet, interposer, TSV, high-density interconnect and hybrid bonding development
Take packaging concepts from customer requirements through prototyping, demonstrators and qualification
Define packaging technology roadmaps and drive long-term innovation
Lead multidisciplinary technical projects across design, assembly, thermal and test
Develop advanced microelectronic modules and system demonstrators
Provide technical leadership across design, validation and qualification
Support hands-on prototyping and laboratory development
Contribute to technical proposals, bids and collaborative R&D programmes
Manage technical risks and support technology decisions with customers and partners
Requirements
Strong experience in advanced semiconductor packaging and heterogeneous integration
Expertise in 2.5D/3D packaging, chiplets and advanced assembly
Experience with substrates, interposers, TSVs and/or hybrid bonding
Proven experience leading semiconductor packaging development projects
Understanding of the full packaging lifecycle from design through qualification
Knowledge of signal integrity, power integrity and thermal management xsabvtc
Experience taking R&D concepts through to working prototypes or demonstrators
Strong technical leadership, problem-solving and communication skills
Experience in AI, HPC, telecoms or photonics is desired but not a must
Benefits
Competitive salary + bonus
Sponsorship + Relocation assistance
Company pension
Private healthcare for you and your family
Hybrid working to fit around your schedule
A healthy work environment, with great work life balance
If you are interested, contact Ella Flynn at IC Resources.
Principal Packaging Engineer in Barton employer: Intellectual Capital Resources
Join a dynamic team where innovation meets collaboration, as we empower our Opto Mechanical Engineers to transform cutting-edge optical concepts into tangible products. Our supportive work culture fosters continuous learning and professional growth, with hands-on opportunities in a state-of-the-art laboratory environment. Located in a vibrant area, we offer competitive benefits and a chance to work alongside industry experts, making this an ideal place for those seeking meaningful and rewarding employment.
Contact Details:
Intellectual Capital Resources Recruitment Team
