Intellectual Capital Resources Ltd. seeks a Director of Semiconductor Packaging to lead the development of advanced GaN packaging solutions. You will set strategy, build team capability and collaborate with internal teams and external partners to drive innovative, reliable, high‑density packages.
You will direct die attach, flip‑chip, wire bonding and embedded packaging work, while guiding verification, qualification and thermal testing to meet stringent performance targets.
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GaN Power Packaging Director — Lead Strategy & Innovation employer: Intellectual Capital Resources Ltd
Intellectual Capital Resources Ltd is an exceptional employer located in the vibrant city of Glasgow, offering a dynamic work culture that fosters innovation and collaboration. Employees benefit from extensive growth opportunities in cutting-edge technology fields, particularly in embedded cryptography, while enjoying a supportive environment that values teamwork and professional development.
Contact Details:
Intellectual Capital Resources Ltd Recruitment Team
