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- Tasks: Lead the development of innovative 2.5D and 3D semiconductor packaging solutions.
- Company: Join a forward-thinking company at the forefront of semiconductor technology.
- Benefits: Enjoy a competitive salary, generous pension, annual bonus, and private medical cover.
- Why this job: Make a real impact in AI applications while leading cutting-edge packaging projects.
- Qualifications: Strong experience in semiconductor packaging design and proven leadership skills required.
- Other info: Exciting opportunity for career growth and relocation support available.
The predicted salary is between 48000 - 72000 £ per year.
My client is looking for a Principal Semiconductor Packaging Engineer to lead the development of next-generation 2.5D and 3D packaging technologies.
What you’ll do:
- Architect innovative 2.5D/3D packaging solutions from concept to prototype.
- Lead advanced packaging R&D programmes and technology roadmaps.
- Oversee design, assembly, test, and validation of complex semiconductor packages.
- Collaborate across teams to solve system-level packaging challenges.
- Represent the company in technical discussions, bids, and industry forums.
What we’re looking for:
- Strong experience in semiconductor package design and development (3D/2.5D).
- Proven track record leading microelectronics packaging projects.
- Deep understanding of design, modelling, and validation processes.
- Excellent communication, leadership, and problem-solving skills.
Benefits:
- Competitive salary
- 15% pension (10% employer)
- Annual bonus
- Private medical cover extended to family
- Sponsorship with up to £5000 in relocation fees
If you’re looking for a strategic, hands-on role that aims to define and deliver next-generation packaging for AI applications, contact Ella Flynn at IC Resources.
Principal Packaging Engineer in Wales employer: IC Resources
Contact Detail:
IC Resources Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land Principal Packaging Engineer in Wales
✨Tip Number 1
Network like a pro! Reach out to industry professionals on LinkedIn or at events. We can’t stress enough how important it is to make connections that could lead to job opportunities.
✨Tip Number 2
Prepare for interviews by practising common questions related to semiconductor packaging. We recommend doing mock interviews with friends or mentors to boost your confidence and refine your answers.
✨Tip Number 3
Showcase your projects! Create a portfolio that highlights your experience in 2.5D/3D packaging solutions. We love seeing tangible examples of your work, so make sure to bring this up during discussions.
✨Tip Number 4
Don’t forget to apply through our website! It’s the best way to ensure your application gets noticed. Plus, we’re always looking for passionate individuals to join our team.
We think you need these skills to ace Principal Packaging Engineer in Wales
Some tips for your application 🫡
Tailor Your CV: Make sure your CV highlights your experience in semiconductor packaging, especially 2.5D and 3D technologies. We want to see how your skills align with the role, so don’t be shy about showcasing relevant projects you've led!
Craft a Compelling Cover Letter: Your cover letter is your chance to shine! Use it to explain why you’re passionate about semiconductor packaging and how your leadership experience can drive innovation at our company. Keep it engaging and personal!
Showcase Your Problem-Solving Skills: In your application, highlight specific examples where you've tackled complex packaging challenges. We love seeing how you approach problems and come up with creative solutions, so don’t hold back!
Apply Through Our Website: We encourage you to apply directly through our website for a smoother process. It helps us keep track of applications and ensures you get the attention you deserve. Plus, it’s super easy!
How to prepare for a job interview at IC Resources
✨Know Your Packaging Inside Out
Make sure you brush up on your knowledge of 2.5D and 3D packaging technologies. Be ready to discuss specific projects you've worked on, the challenges you faced, and how you overcame them. This will show your depth of experience and passion for semiconductor packaging.
✨Showcase Your Leadership Skills
Since this role involves leading R&D programmes, be prepared to share examples of how you've successfully led teams in the past. Highlight your communication style and how you motivate others to achieve project goals. This will demonstrate that you're not just a technical expert but also a capable leader.
✨Prepare for Technical Discussions
Expect to engage in technical discussions during the interview. Brush up on the latest trends in semiconductor packaging and be ready to discuss how you would approach system-level challenges. This will help you stand out as someone who is not only knowledgeable but also forward-thinking.
✨Ask Insightful Questions
Interviews are a two-way street, so prepare some thoughtful questions about the company's technology roadmaps and future projects. This shows your genuine interest in the role and helps you assess if the company aligns with your career goals.
