IC Resources is seeking a Principal Packaging Engineer to lead and define strategies for advanced 2.5D/3D packaging, heterogeneous integration and next-generation semiconductor systems across AI, HPC, RF, power and photonics. You will provide technical leadership, drive packaging roadmaps and oversee prototyping, qualification and collaboration with customers and partners.
The role requires a strong technical background and proven leadership experience to advance concepts from requirements to
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Principal Packaging Architect: 2.5D/3D & Chiplet Leadership in Wales employer: IC Resources
Join a forward-thinking semiconductor company that values innovation and excellence in digital design. With a strong emphasis on mentorship and professional growth, you'll thrive in a collaborative environment where your leadership will directly impact the success of complex ASIC/FPGA projects. Located in a vibrant tech hub, this role offers unique opportunities to shape methodologies and drive cutting-edge solutions while enjoying a supportive work culture that prioritises employee development.
