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- Tasks: Lead the packaging roadmap for quantum processor devices and develop innovative packaging methods.
- Company: Join a cutting-edge company based in Oxford, pioneering advancements in semiconductor technology.
- Benefits: Enjoy competitive salary, opportunities for professional growth, and a collaborative work environment.
- Why this job: Be at the forefront of technology, making a real impact in the quantum computing field.
- Qualifications: Degree qualified with experience in semiconductor/photonic packaging and strong communication skills.
- Other info: Work closely with both internal teams and external suppliers to drive innovation.
The predicted salary is between 48000 - 84000 £ per year.
Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices. The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.
Required skills for the Principal Packaging Engineer will include:
- Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
- Knowledge of die bonding methods for good thermal and mechanical performance
- Experience working with 3rd party suppliers
- Strong internal and external communication skills
- Degree qualified
Please contact Rachel Anderson for further details.
Principal Semiconductor Packaging Engineer employer: IC Resources
Contact Detail:
IC Resources Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land Principal Semiconductor Packaging Engineer
✨Tip Number 1
Network with professionals in the semiconductor and photonics fields. Attend industry conferences or webinars to meet potential colleagues and learn about the latest trends, which can give you an edge in discussions during interviews.
✨Tip Number 2
Familiarise yourself with the specific packaging methods mentioned in the job description, such as wirebond and bumping techniques. Being able to discuss these methods confidently will demonstrate your expertise and enthusiasm for the role.
✨Tip Number 3
Prepare to showcase your experience with third-party suppliers. Think of examples where you've successfully collaborated with external partners, as this will highlight your communication skills and ability to manage relationships effectively.
✨Tip Number 4
Brush up on your knowledge of thermal and mechanical performance in packaging. Be ready to discuss how you've addressed these challenges in past projects, as this will show your problem-solving abilities and technical understanding.
We think you need these skills to ace Principal Semiconductor Packaging Engineer
Some tips for your application 🫡
Understand the Role: Read the job description thoroughly to grasp the specific requirements and responsibilities of the Principal Semiconductor Packaging Engineer position. Highlight your relevant experience in semiconductor and photonic packaging methods.
Tailor Your CV: Customise your CV to reflect your experience with wirebond and bumping methods, as well as your knowledge of package substrate technologies. Make sure to include any relevant projects or achievements that demonstrate your expertise.
Craft a Compelling Cover Letter: Write a cover letter that showcases your strong internal and external communication skills. Mention your experience working with third-party suppliers and how you can contribute to the company's packaging roadmap.
Proofread and Submit: Before submitting your application, proofread all documents for clarity and correctness. Ensure that your application is submitted through our website, and double-check that all required information is included.
How to prepare for a job interview at IC Resources
✨Showcase Your Technical Expertise
Be prepared to discuss your experience with semiconductor and photonic packaging methods in detail. Highlight specific projects where you developed wirebond and bumping methods, as well as any innovative solutions you've implemented for thermal performance.
✨Demonstrate Collaboration Skills
Since the role involves working with internal teams and external suppliers, be ready to share examples of successful collaborations. Discuss how you effectively communicated and coordinated with different stakeholders to achieve project goals.
✨Prepare for Problem-Solving Scenarios
Expect questions that assess your ability to design and supervise failure analysis experiments. Think of past challenges you've faced in packaging engineering and how you approached problem-solving to overcome them.
✨Research the Company and Its Innovations
Familiarise yourself with the company's recent advancements in quantum processor devices and their packaging roadmap. Showing genuine interest in their work will demonstrate your enthusiasm for the role and help you connect your skills to their needs.
