Find a job 
Featured Companies 
Featured Universities 
For Companies At a Glance
- Tasks: Lead the packaging roadmap for quantum processor devices and develop innovative packaging methods.
- Company: Join a cutting-edge company based in Oxford, pioneering advancements in semiconductor technology.
- Benefits: Enjoy competitive salary, opportunities for growth, and a collaborative work environment.
- Why this job: Be at the forefront of technology, making a real impact in the quantum computing field.
- Qualifications: Degree qualified with experience in semiconductor/photonic packaging and strong communication skills.
- Other info: Work closely with both internal teams and external suppliers to drive innovation.
The predicted salary is between 43200 - 72000 £ per year.
Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices. The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.
Required skills for the Principal Packaging Engineer will include:
- Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
- Knowledge of die bonding methods for good thermal and mechanical performance
- Experience working with 3rd party suppliers
- Strong internal and external communication skills
- Degree qualified
Please contact Rachel Anderson for further details.
Contact Detail:
IC Resources Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land Principal Semiconductor Packaging Engineer
✨Tip Number 1
Network with professionals in the semiconductor and photonics fields. Attend industry conferences or local meetups to connect with potential colleagues and employers who can provide insights into the latest packaging technologies and trends.
✨Tip Number 2
Showcase your experience with specific packaging methods in your conversations. Be prepared to discuss your hands-on experience with wirebonding, bumping methods, and thermal performance techniques during interviews to demonstrate your expertise.
✨Tip Number 3
Research our company’s recent projects and innovations in semiconductor packaging. This will not only help you understand our goals but also allow you to ask informed questions during your interview, showing your genuine interest in the role.
✨Tip Number 4
Prepare to discuss your collaboration experiences with third-party suppliers. Highlight any successful partnerships you've had and how they contributed to project outcomes, as this is crucial for the role we are offering.
We think you need these skills to ace Principal Semiconductor Packaging Engineer
Some tips for your application 🫡
Understand the Role: Read the job description thoroughly to grasp the specific requirements and responsibilities of the Principal Semiconductor Packaging Engineer position. Highlight your relevant experience in semiconductor and photonic packaging methods.
Tailor Your CV: Customise your CV to reflect your experience with wirebond and bumping methods, as well as your knowledge of package substrate technologies. Make sure to include any relevant projects or achievements that demonstrate your expertise.
Craft a Compelling Cover Letter: Write a cover letter that showcases your strong internal and external communication skills. Mention your experience working with third-party suppliers and how you can contribute to the company's packaging roadmap.
Proofread Your Application: Before submitting, carefully proofread your application materials for any errors or inconsistencies. A polished application reflects your attention to detail, which is crucial for a technical role like this.
How to prepare for a job interview at IC Resources
✨Showcase Your Technical Expertise
Be prepared to discuss your experience with semiconductor and photonic packaging methods in detail. Highlight specific projects where you developed wirebond and bumping methods, as well as any innovative solutions you've implemented for thermal performance.
✨Demonstrate Collaboration Skills
Since the role involves working with internal teams and external suppliers, be ready to share examples of successful collaborations. Discuss how you effectively communicated and coordinated with different stakeholders to achieve project goals.
✨Prepare for Problem-Solving Scenarios
Expect questions that assess your ability to design and supervise failure analysis experiments. Think of past challenges you've faced in packaging engineering and how you approached problem-solving to overcome them.
✨Research the Company and Its Products
Familiarise yourself with the company's work in quantum processor devices and their packaging roadmap. Understanding their current projects and technologies will help you tailor your responses and show genuine interest in the role.
