Principal RF IC Design Engineer - SATCOM

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Client:

ic resources

Location:

Cambridge, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Reference:

581b192deb70

Job Views:

4

Posted:

02.06.2025

Expiry Date:

17.07.2025

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Job Description:

This is an exciting opportunity for an experienced RF IC Design or MMIC Designer to join an expanding company working on high-tech communications and radar technologies.

In this role, you will work on antenna technology serving markets including broadband mobility, satellite communications, and Internet of Things (IoT).

As the Principal RF IC Design Engineer, you will lead the design of Ku/Ka band RF Transmitters & Receivers using deep sub-micron technologies for next-generation satellite communications. You will be responsible for ASIC specifications, architecture design, circuit design & verification, reviews, IC qualification, and production release.

You will develop new circuit architectures, design/verification methodologies to meet performance requirements within timelines. You will own and lead chip-level development, collaborate with block-level design and layout engineers, and work with the test team on test plans and ASIC characterization.

You will lead and mentor RF IC Design engineers and coordinate with layout, test, systems, antenna, and hardware teams to ensure timely delivery of ASICs. You will assist in selecting fabrication processes and vendors, setting up process flows, and establishing design governance, development plans, and technology roadmaps.

Industry degree qualified candidates with a minimum of 10 years of RF IC design experience in deep sub-micron technologies (preferably 15GHz or higher frequencies) and chip lead experience in at least 2 successful tape-outs are suitable.

Responsibilities include:

• ASIC specifications, architecture, top-level design & verification, block-level design, and tape-out.
• Design of transmitter & receiver blocks in Ku/Ka band in deep sub-micron CMOS technologies.
• Hands-on design of RF blocks such as PA, LNA, VGA, phase shifters, power splitters/combiners.
• Delivering high-performance RF/Analog blocks with innovative architectures.
• Coordinate and manage design activities across teams.
• Collaborate with CAD, process technology, packaging, antenna, and hardware teams.
• Document work and lead design reviews.
• Experience in 22nm FDSOI or other sub-45nm CMOS nodes for RF/High-speed ICs and mmW/RF IC design is desirable.

Excellent communication skills and responsibility for complex designs within deadlines are required. Ability to interact with multidisciplinary teams during ASIC development is essential.

Contact Leon to apply and find out more.

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