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- Tasks: Lead the development of innovative 2.5D and 3D semiconductor packaging solutions.
- Company: Join a forward-thinking company at the forefront of semiconductor technology.
- Benefits: Competitive salary, generous pension, annual bonus, and family medical cover.
- Why this job: Shape the future of AI applications with cutting-edge packaging technologies.
- Qualifications: Strong experience in semiconductor packaging design and leadership skills.
- Other info: Exciting opportunity for career growth in a dynamic industry.
The predicted salary is between 42000 - 84000 £ per year.
My client is looking for a Principal Semiconductor Packaging Engineer to lead the development of next-generation 2.5D and 3D packaging technologies.
What you'll do:
- Architect innovative 2.5D/3D packaging solutions from concept to prototype.
- Lead advanced packaging R&D programmes and technology roadmaps.
- Oversee design, assembly, test, and validation of complex semiconductor packages.
- Collaborate across teams to solve system-level packaging challenges.
- Represent the company in technical discussions, bids, and industry forums.
What we're looking for:
- Strong experience in semiconductor package design and development (3D/2.5D)
- Proven track record leading microelectronics packaging projects.
- Deep understanding of design, modelling, and validation processes.
- Excellent communication, leadership, and problem-solving skills.
Benefits:
- Competitive salary
- 15% pension (10% employer)
- Annual bonus
- Private medical cover extended to family
- Sponsorship with up to £5000 in relocation fees
If you\’re looking for a strategic, hands-on role aims to define and deliver next-generation packaging for AI applications, contact Ella Flynn at IC Resources.
Principal Packaging Engineer employer: IC Resources
Contact Detail:
IC Resources Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land Principal Packaging Engineer
✨Tip Number 1
Network like a pro! Reach out to industry professionals on LinkedIn or attend relevant events. We can’t stress enough how important it is to make connections that could lead to job opportunities.
✨Tip Number 2
Prepare for interviews by practising common questions and showcasing your experience in semiconductor packaging. We recommend using the STAR method to structure your answers – it really helps highlight your skills!
✨Tip Number 3
Don’t just wait for job postings; be proactive! Reach out directly to companies you admire, like ours, and express your interest. We love seeing passionate candidates who take the initiative.
✨Tip Number 4
Keep your online presence sharp! Update your LinkedIn profile with your latest achievements and projects. We want to see what you’ve been up to, so make sure it reflects your expertise in 2.5D and 3D packaging technologies.
We think you need these skills to ace Principal Packaging Engineer
Some tips for your application 🫡
Tailor Your CV: Make sure your CV is tailored to highlight your experience in semiconductor packaging, especially 2.5D and 3D technologies. We want to see how your skills align with the role, so don’t be shy about showcasing relevant projects you've led!
Craft a Compelling Cover Letter: Your cover letter is your chance to shine! Use it to explain why you’re passionate about semiconductor packaging and how your leadership experience can drive innovation at our company. Keep it engaging and personal – we love a good story!
Showcase Your Problem-Solving Skills: In your application, highlight specific examples where you've tackled complex packaging challenges. We’re looking for those who can think outside the box, so don’t hold back on sharing your creative solutions and outcomes!
Apply Through Our Website: We encourage you to apply directly through our website. It’s the best way for us to receive your application and ensures you’re considered for the role. Plus, it shows you’re keen on joining our team!
How to prepare for a job interview at IC Resources
✨Know Your Packaging Inside Out
Make sure you brush up on your knowledge of 2.5D and 3D packaging technologies. Be ready to discuss specific projects you've worked on, the challenges you faced, and how you overcame them. This will show your depth of experience and passion for semiconductor packaging.
✨Showcase Your Leadership Skills
Since this role involves leading R&D programmes, be prepared to share examples of how you've successfully led teams in the past. Highlight your communication and problem-solving skills, and how you've collaborated with cross-functional teams to achieve project goals.
✨Prepare for Technical Discussions
Expect to engage in technical discussions during the interview. Brush up on the latest trends in semiconductor packaging and be ready to discuss how you would approach system-level packaging challenges. This will demonstrate your expertise and strategic thinking.
✨Ask Insightful Questions
Prepare thoughtful questions about the company's technology roadmaps and future projects. This shows your genuine interest in the role and helps you assess if the company aligns with your career goals. Plus, it gives you a chance to engage with the interviewers on a deeper level.
