Electrical Packaging Engineer: High-Volume Photonics ICs in Oxford
Electrical Packaging Engineer: High-Volume Photonics ICs

Electrical Packaging Engineer: High-Volume Photonics ICs in Oxford

Oxford Full-Time 42000 - 60000 £ / year (est.) No home office possible
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At a Glance

  • Tasks: Design and deliver innovative electrical packaging solutions for photonic and electronic modules.
  • Company: Leading technology company in the UK with a focus on innovation.
  • Benefits: Competitive salary, health benefits, and opportunities for professional growth.
  • Why this job: Join a dynamic team and work on cutting-edge technology in high-volume production.
  • Qualifications: Experience in electrical packaging, substrate design, and thermal management techniques.
  • Other info: Collaborative environment with a strong emphasis on performance and reliability.

The predicted salary is between 42000 - 60000 £ per year.

A leading technology company in the UK is seeking an experienced Electrical Packaging Engineer. This role focuses on the design and delivery of complex electrical packaging solutions for photonic and electronic modules. The engineer will work closely with manufacturing partners to ensure high volume production while meeting yield, performance, thermal, and reliability standards.

Ideal candidates will have strong electrical packaging experience, especially in substrate and interposer design, and knowledge of thermal management techniques.

Electrical Packaging Engineer: High-Volume Photonics ICs in Oxford employer: IC Resources

As a leading technology company in the UK, we pride ourselves on fostering a collaborative and innovative work culture that empowers our employees to excel. With a strong focus on professional development, we offer numerous growth opportunities and support for continuous learning, ensuring that our team members thrive in their careers. Our commitment to high-quality production and cutting-edge technology makes us an attractive employer for those seeking meaningful and rewarding work in the field of electrical packaging engineering.
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Contact Detail:

IC Resources Recruiting Team

StudySmarter Expert Advice 🤫

We think this is how you could land Electrical Packaging Engineer: High-Volume Photonics ICs in Oxford

✨Tip Number 1

Network like a pro! Reach out to your connections in the industry, attend relevant events, and don’t be shy about asking for introductions. We all know that sometimes it’s not just what you know, but who you know that can land you that dream job.

✨Tip Number 2

Prepare for interviews by researching the company and its products. Understand their challenges in electrical packaging and think about how your skills can help solve them. We want you to walk in with confidence and show them you’re the perfect fit!

✨Tip Number 3

Practice makes perfect! Do mock interviews with friends or use online platforms to get comfortable with common questions. We believe that the more you practice, the more natural you’ll feel when it’s time to shine in front of the hiring team.

✨Tip Number 4

Don’t forget to follow up after your interview! A simple thank-you email can go a long way in keeping you top of mind. We recommend mentioning something specific from your conversation to show you were engaged and genuinely interested.

We think you need these skills to ace Electrical Packaging Engineer: High-Volume Photonics ICs in Oxford

Electrical Packaging Design
Substrate Design
Interposer Design
Thermal Management Techniques
High Volume Production
Yield Management
Performance Standards
Reliability Standards
Collaboration with Manufacturing Partners

Some tips for your application 🫡

Tailor Your CV: Make sure your CV highlights your experience in electrical packaging, especially with photonics ICs. We want to see how your skills align with the role, so don’t be shy about showcasing relevant projects!

Craft a Compelling Cover Letter: Your cover letter is your chance to shine! Use it to explain why you’re passionate about electrical packaging and how your background makes you a perfect fit for our team. Keep it engaging and personal!

Showcase Your Technical Skills: Don’t forget to mention your expertise in substrate and interposer design, as well as any thermal management techniques you’ve mastered. We love seeing candidates who can bring technical know-how to the table!

Apply Through Our Website: We encourage you to apply directly through our website. It’s the best way for us to receive your application and ensures you’re considered for the role. Plus, it’s super easy!

How to prepare for a job interview at IC Resources

✨Know Your Stuff

Make sure you brush up on your electrical packaging knowledge, especially around substrate and interposer design. Be ready to discuss specific projects you've worked on and how they relate to photonic and electronic modules.

✨Showcase Your Collaboration Skills

Since this role involves working closely with manufacturing partners, be prepared to share examples of how you've successfully collaborated in the past. Highlight any experiences where you ensured high volume production while maintaining quality standards.

✨Thermal Management is Key

Familiarise yourself with thermal management techniques relevant to electrical packaging. You might be asked about how you've tackled thermal issues in previous projects, so have some solid examples ready to go.

✨Ask Insightful Questions

Prepare thoughtful questions about the company's approach to yield, performance, and reliability standards. This shows your genuine interest in the role and helps you understand if the company aligns with your career goals.

Electrical Packaging Engineer: High-Volume Photonics ICs in Oxford
IC Resources
Location: Oxford
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  • Electrical Packaging Engineer: High-Volume Photonics ICs in Oxford

    Oxford
    Full-Time
    42000 - 60000 £ / year (est.)
  • I

    IC Resources

    50-100
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