Senior Packaging Engineer in Newport

Senior Packaging Engineer in Newport

Newport Full-Time 60000 - 80000 € / year (est.) No home office possible
IC Resources

At a Glance

  • Tasks: Lead advanced packaging processes and design high-speed interconnect solutions.
  • Company: Innovative tech firm specialising in microelectronics and advanced packaging technologies.
  • Benefits: Competitive salary, life assurance, pension, private medical insurance, and flexible working hours.
  • Other info: Onsite role in Wales with excellent career growth and relocation assistance.
  • Why this job: Join a cutting-edge team and shape the future of AI infrastructure and photonic systems.
  • Qualifications: Strong experience in semiconductor packaging and hands-on skills in 2.5D/3D integration.

The predicted salary is between 60000 - 80000 € per year.

My client is looking for a Senior Packaging Process Engineer, to be an expert in leading microelectronics assembly and validation, specialising in advanced packaging technologies. The Senior Packaging Process Engineer will work on advanced AI infrastructure, co-packaged RF architectures, and photonic systems. This is an onsite position based in Wales.

Responsibilities

  • Develop advanced packaging assembly processes including 2.5D and 3D integration
  • Design and validate high-speed interconnect solutions for system-in-package platforms
  • Define interconnect schemes including flip chip, wafer-level packaging and hybrid bonding
  • Develop process flows covering die attach, underfill, bonding and encapsulation
  • Lead design-for-manufacturing activities with internal and external teams
  • Run DOEs, reliability testing, failure analysis and process control
  • Work with suppliers, partners and customers to evaluate materials and equipment
  • Support lab-based activities including process characterisation and prototyping
  • Lead technical projects and contribute to proposals and funding activities
  • Provide technical guidance across multidisciplinary engineering teams

Requirements

  • Strong experience in semiconductor packaging and microelectronics assembly
  • Hands-on experience with 2.5D/3D integration, hybrid bonding and SiP
  • Knowledge of TSV, RDL and wafer-level packaging processes
  • Experience leading R&D or packaging development projects
  • Understanding of electrical, thermal and system-level integration challenges
  • Familiarity with cleanroom environments and process control methods
  • Strong problem-solving and analytical capability
  • Ability to work across multidisciplinary teams

Benefits:

  • Competitive salary
  • Life Assurance - 4 times annual salary
  • 15% pension
  • 28 days annual leave in addition to bank holidays
  • Private medical insurance for you and your family
  • Visa Sponsorship and financial relocation assistance
  • Flexible working hours

If you are interested, contact Ella Flynn for more details.

Senior Packaging Engineer in Newport employer: IC Resources

Join a forward-thinking company in Wales as a Senior Packaging Process Engineer, where you will be at the forefront of advanced packaging technologies and microelectronics assembly. With a strong emphasis on employee growth, competitive benefits including a generous pension scheme, private medical insurance, and flexible working hours, this role offers a unique opportunity to contribute to cutting-edge projects while enjoying a supportive work culture that values innovation and collaboration.

IC Resources

Contact Detail:

IC Resources Recruiting Team

StudySmarter Expert Advice🤫

We think this is how you could land Senior Packaging Engineer in Newport

Tip Number 1

Network like a pro! Reach out to your connections in the semiconductor and microelectronics fields. Attend industry events or webinars to meet potential employers and showcase your expertise in advanced packaging technologies.

Tip Number 2

Prepare for interviews by brushing up on your technical knowledge. Be ready to discuss your hands-on experience with 2.5D/3D integration and hybrid bonding. We want you to shine when they ask about your problem-solving skills and past projects!

Tip Number 3

Don’t just apply anywhere; focus on companies that align with your career goals. Use our website to find roles that excite you, like the Senior Packaging Engineer position. Tailor your approach to show how you can contribute to their advanced AI infrastructure.

Tip Number 4

Follow up after interviews! A quick thank-you email can go a long way. Mention something specific from your conversation to remind them of your fit for the role. It shows your enthusiasm and keeps you top of mind!

We think you need these skills to ace Senior Packaging Engineer in Newport

Microelectronics Assembly
Advanced Packaging Technologies
2.5D Integration
3D Integration
High-Speed Interconnect Solutions
Flip Chip Packaging
Wafer-Level Packaging

Some tips for your application 🫡

Tailor Your CV:Make sure your CV is tailored to highlight your experience in semiconductor packaging and microelectronics assembly. We want to see how your skills align with the advanced packaging technologies mentioned in the job description.

Craft a Compelling Cover Letter:Your cover letter should tell us why you're the perfect fit for the Senior Packaging Engineer role. Share specific examples of your hands-on experience with 2.5D/3D integration and any relevant projects you've led.

Showcase Your Problem-Solving Skills:In your application, don’t forget to mention your strong problem-solving and analytical capabilities. We love candidates who can tackle challenges head-on, especially in multidisciplinary teams.

Apply Through Our Website:For the best chance of success, make sure to apply through our website. It’s the easiest way for us to keep track of your application and get back to you quickly!

How to prepare for a job interview at IC Resources

Know Your Packaging Processes

Make sure you brush up on your knowledge of advanced packaging technologies, especially 2.5D and 3D integration. Be ready to discuss specific processes like die attach and hybrid bonding, as well as any hands-on experience you've had in semiconductor packaging.

Showcase Your Problem-Solving Skills

Prepare examples of how you've tackled challenges in previous projects. Whether it's running DOEs or conducting failure analysis, having concrete examples will demonstrate your analytical capabilities and how you can contribute to their multidisciplinary teams.

Familiarise Yourself with the Company’s Projects

Research the company’s current projects, especially those related to AI infrastructure and photonic systems. This will not only show your interest but also help you align your skills with their needs during the interview.

Ask Insightful Questions

Prepare thoughtful questions about their design-for-manufacturing activities or how they approach reliability testing. This shows that you're engaged and genuinely interested in how you can fit into their team and contribute to their goals.