At a Glance
- Tasks: Lead the assembly process for die attach and wire bonding in high-volume production.
- Company: Join a leading company in semiconductor manufacturing based in Sedgefield.
- Benefits: Competitive salary, career development opportunities, and a supportive work environment.
- Other info: Dynamic role with opportunities for innovation and professional growth.
- Why this job: Make a significant impact on product quality and efficiency in cutting-edge technology.
- Qualifications: Engineering degree and experience in semiconductor assembly processes required.
The predicted salary is between 40000 - 50000 £ per year.
IC Resources is seeking an Assembly Process Engineer based in Sedgefield, England. This role focuses on product assembly, particularly in high volume automated die attach and wire bonding processes. You will develop and maintain the necessary equipment while providing technical support for yield improvements.
The ideal candidate has a relevant engineering degree and experience in semiconductor assembly manufacturing processes. Strong knowledge of process improvement and equipment management is essential for success in this position.
Lead Assembly Process Engineer: Die Attach & Wire Bonding employer: IC Resources
IC Resources is an exceptional employer that fosters a collaborative and innovative work culture in Sedgefield, England. With a strong emphasis on employee growth, we offer comprehensive training and development opportunities tailored to enhance your skills in semiconductor assembly processes. Join us to be part of a dynamic team where your contributions directly impact product quality and efficiency, all while enjoying the benefits of working in a supportive environment focused on continuous improvement.
