At a Glance
- Tasks: Drive assembly and packaging for innovative RF semiconductor products.
- Company: Join Forefront RF, a leader in breakthrough RF technology.
- Benefits: Enjoy competitive salary, flexible hours, and great perks like company lunches.
- Other info: Collaborative environment with opportunities for growth and innovation.
- Why this job: Shape the future of connectivity with cutting-edge semiconductor technology.
- Qualifications: Degree in relevant engineering field and experience in semiconductor assembly.
The predicted salary is between 40000 - 50000 £ per year.
Forefront RF is a fabless semiconductor company developing breakthrough RF technology that radically simplifies RF front-end architectures for mobile and connected devices. Our long-term vision is to empower anyone to treat global connectivity as a commodity, effortlessly adding it to any device. We lead through innovation, solving our customers’ toughest challenges, enabling them to stay ahead by pushing the boundaries of RF design.
Our Values
- One team: We listen, share, and build solutions together. Collaboration is at the heart of how we work. We support one another, embrace challenges and fun, and celebrate collective success.
- Innovation with intent: We operate at the forefront of technology, building innovative pathways to the future that meets real customer needs.
- Solutions driven: We develop world leading manufacturable products that deliver effortless connectivity.
- Customer focused: We act with integrity, hold ourselves accountable, and are guided by a deep commitment to deliver customer focused solutions.
- Sustainable: We design for longevity and reuse - leveraging globally connected RF technology to extend product lifecycles and reduce waste.
Role Overview
We’re looking for an Assembly Engineer to help drive the assembly and packaging activities behind our RF semiconductor products as we continue to scale the business. This is a newly created role and an exciting opportunity to shape how we develop and transition products from prototype through to volume production. You’ll work closely with design, test, operations, suppliers, and manufacturing partners in a hands‑on engineering environment, helping deliver robust, scalable, and high‑quality packaging solutions for next‑generation products.
Key Responsibilities
- Manage semiconductor assembly activities across prototype and production builds.
- Work with OSAT and manufacturing partners on package assembly and process development.
- Support new product introduction (NPI) and manufacturing readiness activities.
- Drive yield improvement and root‑cause analysis for assembly‑related issues.
- Coordinate reliability testing, qualification, and failure analysis activities.
- Collaborate with design, test, and product engineering teams to optimize manufacturability.
- Create and maintain assembly documentation, process flows, and manufacturing specifications.
- Identify continuous improvement opportunities across quality, cost, and production efficiency.
Requirements
About you
You’re excited by the opportunity to work with breakthrough technologies. You may thrive in this role if you have some or all the following:
Education & experience
- Degree in Electronic Engineering, Materials Science, Manufacturing Engineering, or similar.
- Experience in semiconductor assembly, packaging, or manufacturing engineering.
- Understanding of semiconductor packaging and assembly processes.
- Familiarity with OSATs and outsourced semiconductor manufacturing.
- Experience with yield improvement, failure analysis, and process optimisation.
- Experience with RF or mixed‑signal semiconductor products.
- Knowledge of reliability and qualification processes.
- Familiarity with manufacturing data analysis and process control.
- Understanding of advanced semiconductor packaging technologies.
- Experience supporting consumer, IoT, or automotive semiconductor products.
People Skills
- Proactive approach to problem‑solving with a resilient attitude towards ambiguity.
- Excellent problem‑solving and analytical skills.
- Strong communication and collaboration abilities.
- Ability to work independently and as part of a team.
- Attention to detail and commitment to producing high‑quality output.
Benefits
- Competitive salary and pension contributions.
- Company Share Option Scheme.
- 25 days holiday + bank holidays.
- Weekly company lunches.
- Flexible work hours and remote work options.
- Private medical insurance.
- Life assurance x 4.
- Income protection.
- Healthshield Cash plan.
- Heka flexible benefits platform.
We believe in equal opportunities. We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, colour, sex, gender identity, sexual orientation, age, non‑disqualifying physical or mental disability, national origin, veteran status, or any other basis covered by appropriate law. All employment is decided on the basis of qualifications, merit, and business need.
Assembly Engineer (Semiconductors) in Cambridge employer: Forefront RF
Forefront RF is an exceptional employer, offering a dynamic work environment where innovation and collaboration are at the forefront of our mission to revolutionise RF technology. As an Assembly Engineer, you will have the opportunity to shape product development while enjoying competitive benefits such as flexible working hours, private medical insurance, and a supportive culture that values diversity and employee growth. Join us in a role that not only challenges you technically but also allows you to contribute to meaningful advancements in global connectivity.
