At a Glance
- Tasks: Evaluate and optimise die attach and wire bonding processes for RF modules.
- Company: Filtronic PLC, a leader in advanced packaging and assembly.
- Benefits: Competitive salary, health benefits, and opportunities for professional growth.
- Other info: Collaborative environment with strong focus on continuous improvement.
- Why this job: Join a dynamic team and make an impact in cutting-edge RF technology.
- Qualifications: Experience in process engineering and a passion for innovation.
The predicted salary is between 36000 - 44000 £ per year.
Filtronic PLC is expanding its Process Engineering team at Net Park to scale advanced packaging and assembly of RF modules.
The Process Engineer will evaluate, develop, optimise and control die attach and wire bonding processes, ensuring manufacturability and high yield for future products.
You will collaborate with RF, mechanical and operations teams, define tooling and automation needs, run feasibility trials, and drive continuous improvement through SPC, DMAIC and robust validation.
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RF Process Engineer: Die Attach & Wire Bonding in Sedgefield employer: Filtronic
Filtronic is an excellent employer located in the picturesque Torr Vale Mill, offering a dynamic work environment where collaboration and innovation thrive. With a strong commitment to employee growth, we provide opportunities for hands-on experience in cutting-edge RF and mmWave technology, alongside a culture that values diversity and equal opportunities. Join us to be part of a team that not only drives technological advancements but also fosters personal and professional development.
