Filtronic PLC is expanding its Process Engineering team at NetPark to scale advanced packaging and assembly of RF modules. The Process Engineer will evaluate, develop, optimise and control die attach and wire bonding processes, ensuring manufacturability and high yield for future products. You will collaborate with RF, mechanical and operations teams, define tooling and automation needs, run feasibility trials, and drive continuous improvement through SPC, DMAIC and robust validation. #J-18808-Ljbffr
RF Process Engineer: Die Attach & Wire Bonding employer: Filtronic
Filtronic is an exceptional employer, offering a dynamic and collaborative work environment at our cutting-edge headquarters in NETPark, Sedgefield. With a strong focus on employee growth, we provide extensive learning and development opportunities, competitive benefits, and a commitment to diversity and inclusion, making it an ideal place for talented engineers to thrive while working on innovative RF technology that shapes the future of communication and defence systems.
