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For Companies At a Glance
- Tasks: Join our team to enhance manufacturing processes for cutting-edge electronic products.
- Company: Filtronic is a leading manufacturer in telecommunications and defence equipment.
- Benefits: Enjoy opportunities for skill development and work with experienced engineers in a world-class facility.
- Other info: Focus on precision high volume assembly processes and continuous improvement.
- Why this job: Be part of an innovative team, working on exciting projects that impact technology and society.
- Qualifications: Relevant Engineering Degree and experience in electronics manufacturing are essential.
The predicted salary is between 36000 - 60000 ÂŁ per year.
Filtronic PLC is a world leader in the design and manufacture of customised microwave and millimetre wave electronics. Our products are used within satellite, defence, terrestrial telecommunications and other related applications. Our investment in high calibre staff, leading edge technology and a world class manufacturing facility underpin our growth strategy and our aim to be a world class supplier of high frequency products and solutions.
As we scale our advanced packaging and assembly capability at NetPark, we are expanding our Process Engineering team to support the transition of new technologies from development into stable, high-yield production.
The Process Engineer is responsible for the evaluation, development, optimisation and control of advanced semiconductor and RF module assembly processes. The role focuses particularly on die attach technologies (silver epoxy, silver sinter, and eutectic attach) and gold wire/ribbon bonding across a range of substrate and device materials.
In addition, the Process Engineer will work closely with the RF Engineering team to identify, evaluate and mature manufacturing technologies that support the company’s long-term technology roadmap, ensuring future products are scalable, manufacturable and reliable.
The successful candidate will drive process robustness, yield improvement, manufacturability and cost efficiency while supporting new product introduction (NPI) and ongoing production.
Requirements
Key Attributes:
- Analytical and methodical approach
- Strong cross-functional collaboration skills
- Ability to translate technical roadmap requirements into manufacturable solutions
- Comfortable working between development engineering and production operations
- Strong mechanical reasoning and problem‑solving capability
- Proactive and hands‑on within a manufacturing environment
- Able to operate in a fast‑paced scaling organisation
Technology & Roadmap Support
- Partner with RF Engineering to identify suitable materials, processes and assembly technologies aligned to future product requirements
- Evaluate emerging die attach and interconnect technologies to support higher power density, higher frequencies and improved thermal performance
- Provide early manufacturability input into technology roadmap planning
- Assess scalability, automation potential and cost implications of proposed technologies
- Lead feasibility trials and proof‑of‑concept builds for next‑generation processes
- Support make/buy decisions and supplier technology assessment
Die Attach Process Development
- Evaluate and optimise die attach methods including, but not limited to:
- Silver epoxy
- Silver sinter
- Eutectic attach (e.g., AuSn)
- Define process windows (temperature, pressure, time, atmosphere)
- Develop qualification plans and validation methodologies
- Conduct thermal, mechanical and reliability assessments
- Characterise voiding, bond line thickness, shear strength and thermal resistance
- Support material selection and supplier evaluation
Wire Bonding Process Development & Optimisation
- Develop and optimise gold wire bonding processes (ball and wedge bonding)
- Establish bonding parameters for different metallisation and substrate types
- Perform pull and shear testing and reliability validation
- Address intermetallic formation, pad damage and bond integrity challenges
- Support transition to fine‑pitch and high‑frequency capable assemblies
Manufacturing Process Development
- Define, document and control new and existing manufacturing processes
- Develop process flow documentation, SOPs and control plans
- Implement SPC, Cp/Cpk analysis and yield monitoring
- Lead root cause investigations using structured methodologies (8D, DMAIC, FMEA)
- Drive continuous improvement initiatives for yield, cycle time and cost reduction
New Product Introduction (NPI)
- Drive DFM/DFA reviews during product development
- Develop prototype/pilot builds and process validation plans
- Work closely with RF, mechanical, quality and operations teams to ensure manufacturability
- Define tooling, fixturing and automation requirements
Candidate Requirements:
- Degree in Engineering, Materials Science, Physics or related discipline
- Experience in semiconductor or RF module assembly processes
- Hands‑on experience with one or more of the following:
- Silver epoxy die attach
- Silver sintering
- Eutectic die attach
- Gold wire bonding
- Understanding of materials behaviour, intermetallic formation and thermal management
- Experience with process validation and statistical analysis tools
- Strong problem‑solving capability in a manufacturing environment.
Desirable:
- We are particularly interested in candidates from high‑precision automotive electronics or power electronics environments who bring transferable skills in automation, process stability, and zero‑defect manufacturing culture
- Experience in high‑tech, semiconductor, or manufacturing industries
- Experience with equipment specification, procurement, and commissioning
- Knowledge of RF packaging requirements and JEDEC standards
- Experience with thermomechanical modelling and material reliability testing
- Experience within electronics manufacturing environment, preferably as a Process Engineer within RF electronic Production/CEM manufacturing organisation
- Solid grasp of IATF 16949 or ISO 9001; we will provide training for specific standards
Benefits
Please call our Talent Partner, Bruce Mair on 07483 917543 (anytime) if you would like to chat about this role or clarify the salary and benefits prior to investing your time applying.
Filtronic plc is an equal opportunities employer and is committed to building a diverse and inclusive workplace where everyone can thrive. We welcome applications from all qualified candidates regardless of age, gender, ethnicity, religion, sexual orientation, or disability status. If you require any adjustments or accommodations to support you during the interview process, please let us know and we will be happy to assist.
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Process Engineer employer: Filtronic
Contact Detail:
Filtronic Recruiting Team
StudySmarter Expert Advice 🤫
We think this is how you could land Process Engineer
✨Tip Number 1
Familiarise yourself with the specific processes mentioned in the job description, such as die attach and wire bonding. Understanding these techniques will not only help you during interviews but also demonstrate your genuine interest in the role.
✨Tip Number 2
Network with professionals in the electronics manufacturing field, especially those who have experience in RF electronic production. Engaging with industry experts can provide valuable insights and potentially lead to referrals.
✨Tip Number 3
Stay updated on the latest trends and technologies in microwave and mmWave electronics. Showing that you are knowledgeable about current advancements can set you apart from other candidates.
✨Tip Number 4
Prepare to discuss specific examples of how you've applied Lean manufacturing principles in past roles. Being able to articulate your experience with process improvement will highlight your suitability for the position.
We think you need these skills to ace Process Engineer
Some tips for your application 🫡
Tailor Your CV: Make sure your CV highlights relevant experience in electronics manufacturing, particularly as a Process Engineer. Emphasise your knowledge of die attach, wire bonding, and SMT build processes, as well as any experience with Lean manufacturing principles.
Craft a Compelling Cover Letter: Write a cover letter that specifically addresses the responsibilities and requirements outlined in the job description. Mention your relevant engineering degree and how your skills align with Filtronic's needs, particularly in developing and refining processes for microwave and mmWave electronic products.
Showcase Your Technical Skills: In your application, provide examples of past projects or experiences where you improved manufacturing yields or developed new processes. Highlight any technical recommendations you've made during product design and how they contributed to production efficiency.
Proofread and Format: Before submitting your application, carefully proofread all documents for spelling and grammatical errors. Ensure that your CV and cover letter are well-formatted and easy to read, making a professional impression on the hiring team at Filtronic.
How to prepare for a job interview at Filtronic
✨Know Your Processes
Make sure you have a solid understanding of die attach, wire bonding, and SMT build processes. Be prepared to discuss how you've applied these in previous roles, especially in relation to industry standards like MIL-STD-883.
✨Showcase Your Problem-Solving Skills
Be ready to share specific examples of how you've improved processes in the past. Highlight any experience with Lean manufacturing principles and how they contributed to increased efficiency or yield.
✨Familiarise Yourself with the Company
Research Filtronic and their products. Understanding their focus on telecommunications and defence equipment will help you tailor your responses and show genuine interest in the role.
✨Prepare for Technical Questions
Expect technical questions related to process engineering and electronics manufacturing. Brush up on relevant concepts and be ready to explain your thought process when tackling engineering challenges.