At a Glance
- Tasks: Develop and control advanced semiconductor and RF assembly processes.
- Company: Filtronic plc, a leader in microwave and millimetre wave electronics.
- Benefits: Competitive salary, health benefits, and opportunities for professional growth.
- Other info: Dynamic work environment with a focus on quality and cost efficiency.
- Why this job: Join a cutting-edge team and innovate in RF packaging technologies.
- Qualifications: Experience in die attach methods and wire bonding is preferred.
The predicted salary is between 35000 - 45000 £ per year.
Filtronic plc, a world leader in customised microwave and millimetre wave electronics, seeks a Process Engineer to develop and control advanced semiconductor and RF assembly processes. You will advance die attach methods and wire bonding while collaborating with RF engineering to mature manufacturing technologies for scalable, reliable products.
The role focuses on die attach variants (silver epoxy, silver sinter, eutectic) and gold wire bonding, balancing manufacturability, quality and cost.
RF Packaging & Die-Attach Process Engineer in Sedgefield employer: Filtronic plc
Filtronic is an exceptional employer, offering a dynamic work environment where innovation and collaboration thrive. As a Senior NPI Engineer, you'll engage with cutting-edge RF technologies alongside talented professionals, contributing to impactful projects in the space and defence sectors. With a strong focus on employee growth, competitive benefits, and a commitment to diversity and inclusion, Filtronic provides a rewarding career path in a supportive atmosphere.
