At a Glance
- Tasks: Lead the design and evaluation of innovative microelectronic packaging concepts.
- Company: Join Microchip, a leader in next-gen microelectronics with a global reach.
- Benefits: Enjoy competitive pay, global travel opportunities, and a collaborative work environment.
- Other info: Dynamic role with opportunities for professional growth and global exposure.
- Why this job: Make a real impact in cutting-edge technology while working with a diverse team.
- Qualifications: Experience in electrical layout and thermal performance analysis is essential.
The predicted salary is between 50000 - 70000 £ per year.
Microchip's Caldicot site designs and delivers next-generation microelectronic modules for global markets.
The role focuses on researching, designing, and evaluating packaging concepts within a multidisciplinary team of materials, mechanical, electronics, and packaging engineers.
You will lead electrical layout and thermal performance analyses, selecting components to meet stringent specifications while ensuring manufacturability.
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