Senior Process Engineer in Lincoln

Senior Process Engineer – R&D

Location

Lincoln, site based

Hours

35.5 hours per week : Monday to Thursday 08:30 - 16:30; Friday 08:30 - 14:00

Department

Research & Development

About the Role

We are looking for an experienced and technically driven Senior Process Engineer to join our R&D Centre in Lincoln.

This is an exciting opportunity to play a key role in the development of next-generation high-power semiconductor technologies, with a particular focus on materials, processes and packaging for IGBT and Si C power modules.

You will lead and contribute to R&D projects from initial investigation and laboratory development through to prototype and production-scale implementation.

You will have the opportunity to work on challenging technical problems, develop new materials and joining processes, and turn innovative ideas into robust, manufacturable solutions.

The role would suit an experienced process, materials or packaging engineer who enjoys combining hands-on experimental work, technical problem-solving and project leadership.

Key Responsibilities

• Lead R&D activities relating to materials, processes and technologies for high-power semiconductor module packaging.
• Develop, optimise and industrialise joining and interconnection processes, including soldering, sintering, brazing, bonding and other advanced attachment technologies.
• Research, evaluate and select materials including solders, sinter materials, metals, ceramics, polymers, adhesives, silicone gels and other functional materials.
• Investigate material and process-related problems using structured root-cause analysis, failure analysis and Design of Experiments (Do E) techniques.
• Plan and conduct experimental programmes, analyse results and make evidence-based technical recommendations.
• Characterise materials and process outputs using appropriate physical, chemical, mechanical, thermal, electrical and microstructural analysis techniques.
• Develop methods for evaluating bond strength, interfacial integrity, material degradation and reliability.
• Define appropriate test methods and acceptance criteria in line with relevant ISO, ASTM and internal standard s .
• Lead technical projects and workstreams, coordinating activities and ensuring agreed technical outcomes are delivered within timescales.
• Work closely with R&D, engineering, manufacturing, quality, reliability and laboratory teams to translate laboratory findings into practical manufacturing solutions.
• Provide technical input into the design and development of next-generation power modules, considering thermal management, electrical isolation, mechanical stresses, reliability and manufacturability.
• Support the transfer of laboratory-developed processes into prototype and production environments.
• Work with external suppliers, material manufacturers, universities and research organisations to develop and qualify new materials and technologies.
• Prepare technical reports, specifications, presentations, risk assessments and process documentation, communicating complex technical information clearly to a range of audiences.
• Provide technical guidance and mentoring to less experienced engineers, researchers and technicians.
• Contribute to the development of R&D laboratory facilities, experimental methods and material-characterisation capabilities.
• Identify opportunities for innovation and contribute to intellectual property development, including patents and invention disclosures where appropriate.

About You

You will have significant industrial or research experience in materials engineering, process engineering, semiconductor packaging, power electronics or a closely related discipline, together with a demonstrable track record of developing, optimising and troubleshooting materials and manufacturing processes.

You will ideally have practical experience with joining or interconnection technologies such as soldering, sintering, brazing or bonding, particularly within semiconductor, power electronics, automotive, aerospace or another high-reliability environment.

You will also have

• A degree in Materials Science, Materials Engineering, Metallurgy, Mechanical Engineering, Electrical/Electronic Engineering, Physics or a related scientific or engineering discipline.
• Strong experience in experimental planning, process trials, data analysis and interpretation.
• Experience of root-cause analysis, failure investigation and structured technical problem-solving.
• Good knowledge of materials characterisation and analytical techniques, including microscopy, spectroscopy, thermal analysis, mechanical testing or surface/interface analysis.
• A strong understanding of material interfaces, bonding mechanisms and the behaviour of dissimilar materials.
• Working knowledge of relevant ISO, ASTM or other recognised international standards.
• Experience of leading technical projects or workstreams and delivering agreed outcomes.
• Excellent technical report-writing and presentation skills.
• The ability to work independently, make sound technical decisions and collaborate effectively across multidisciplinary teams.
• A strong commitment to scientific integrity, experimental rigour, health and safety, quality and continuous improvement.

Desirable Experience

• Experience in one or more of the following would be highly advantageous:
• IGBT, Si C or other high-power semiconductor module packaging.
• Die attach, substrate attach, power interconnects, encapsulation or electrical insulation systems.
• Pressure-assisted or pressure-less silver or copper sintering.
• High-temperature and high-reliability materials and processes.
• Thermo-mechanical behaviour, coefficient of thermal expansion (CTE), thermal conductivity, residual stress, warpage and fatigue in electronic packages.
• Reliability and accelerated life testing.
• Design of Experiments (Do E), statistical analysis and process capability.
• Transferring laboratory processes into prototype or production-scale manufacturing.
• Working with material suppliers, research institutes, universities or technology partners.
• Technical project management, including risk and resource planning.
• Supervising, mentoring or technically managing engineers, researchers, technicians or students.
• Intellectual property, patents, technical publications or invention disclosures.
• A Master’s degree or Ph D in a relevant discipline would be advantageous, although substantial relevant industrial experience demonstrating an equivalent level of technical knowledge and capability will be considered.

Why Join Us?

This is a fantastic opportunity to join a technically focused R&D environment where your expertise will have a direct impact on the development of advanced power semiconductor products and manufacturing technologies.

You will have the opportunity to work on complex engineering challenges, collaborate with specialists across the business and external technology partners, and help shape the processes and materials that will support the next generation of high-power semiconductor modules.

If you are an experienced engineer looking for a role where you can combine technical expertise, innovation, hands-on experimentation and project leadership, we would love to hear from you.