Senior Power Module Design Engineer in Lincoln

Senior Power Module Design Engineer

Location

Lincoln, site based

Hours

35.5 hours per week : Monday to Thursday 08:30 - 16:30; Friday 08:30 - 14:00

Department

Research & Development

About the Role

We are looking for an innovative and technically driven Senior Power Module Design Engineer to join our R&D team in Lincoln.

This is an exciting opportunity to contribute to the end-to-end development of advanced Silicon Carbide (Si C), Gallium Nitride (Ga N) and Silicon (Si) power semiconductor modules, helping to develop the next generation of high-performance power electronics.

You will be involved in the design and development of advanced packaging solutions for applications including electric vehicle traction inverters, renewable energy systems and high-efficiency industrial drives.

Working within a multidisciplinary R&D environment, you will develop module architectures designed to maximise power density and switching performance, whilst addressing critical electrical, thermal and mechanical requirements.

You will work closely with simulation, materials, process engineering and manufacturing teams to take concepts from CAD design through prototyping, qualification and ultimately into high-volume production.

This is a senior technical role where you will be expected to take ownership of design activities, make sound engineering decisions and contribute to the development of innovative packaging technologies.

Key Responsibilities

• Lead and contribute to the mechanical and packaging design of next-generation IGBT, Si C and Ga N power modules.
• Develop innovative module architectures and packaging concepts that support high power density, fast switching and improved thermal performance.
• Create and develop 3D CAD models and 2D engineering drawings for new concepts and existing product improvements.
• Produce detailed engineering drawings suitable for the manufacture and procurement of components, jigs and fixtures.
• Apply GD&T principles to ensure designs are suitable for manufacture and assembly.
• Design and develop jigs, fixtures and tooling for manufacturing processes, testing and qualification activities.
• Apply engineering principles covering mechanics, strength of materials, materials science, heat transfer, thermodynamics and fluid mechanics to power module design.
• Work with multi-physics simulation teams to assess and optimise electrical, thermal and mechanical performance.
• Use FEA to support design decisions, identify potential failure mechanisms and optimise module structures.
• Consider thermal management, heat extraction, mechanical stresses, material compatibility, reliability and manufacturability throughout the design process.
• Support the development of low-inductance module architectures to improve dynamic performance and minimise voltage overshoot during high-speed switching.
• Take designs from initial concept and CAD development through prototyping, testing, qualification and production implementation.
• Support the continuous improvement of existing and legacy power module products.
• Work closely with R&D, process engineering, manufacturing, materials, reliability and other technical teams to resolve design and production challenges.
• Participate in technical investigations, design reviews, risk assessments and problem-solving activities.
• Apply appropriate experimental and statistical methods to support engineering development and design optimisation.
• Contribute to project planning and delivery, ensuring design activities are completed to agreed timescales and technical requirements.
• Provide technical leadership within projects and contribute to engineering decision-making.
• Maintain awareness of emerging power semiconductor and packaging technologies and identify opportunities for their application within Dynex.
• Prepare clear technical documentation, drawings, reports and presentations and communicate technical information effectively to both technical and non-technical stakeholders.

About You

You will be an experienced mechanical, design or packaging engineer with a strong technical background and a genuine interest in power electronics and advanced semiconductor packaging.

You will have experience of taking engineering designs from concept through development and prototyping, with the ability to apply sound engineering principles to complex, multidisciplinary problems.

We are particularly interested in candidates with experience of electronics packaging, power module design or a related electronics manufacturing environment, although relevant experience from other highly engineered industries will also be considered.

You will have

• A minimum BEng degree or equivalent in Mechanical Engineering or a related discipline such as Mechatronics, Electrical/Electronic Engineering or Physics.
• Strong knowledge of mechanical design, mechanics and strength of materials.
• Good understanding of materials science, heat transfer and thermodynamics.
• Experience of mechanical design within a manufacturing environment, ideally involving electronics or semiconductor packaging.
• Strong hands-on experience using 3D CAD software, such as Solid Edge or Solid Works.
• Experience producing detailed 2D engineering drawings for manufacture and suppliers.
• Good understanding and practical application of GD&T.
• Experience using FEA, ideally with Ansys Mechanical.
• Knowledge of statistics and experimental methods.
• A methodical and structured approach to engineering design and problem-solving.
• Excellent attention to detail and the ability to manage multiple technical activities effectively.
• The ability to work to project deadlines and communicate progress, risks and issues proactively.
• Strong communication and teamwork skills, with the confidence to contribute to and lead technical discussions.

Desirable Experience

• Experience or knowledge in the following areas would be highly advantageous:
• Power module architecture and semiconductor packaging.
• IGBT, Si C MOSFET, Ga N HEMT or PCB-embedded packaging technologies.
• Mechanical design of power semiconductor modules.
• Electrical, thermal and mechanical interaction within semiconductor packages.
• High-power electronics, power semiconductor or automotive applications.
• Thermal management and advanced heat extraction solutions.
• Low-inductance power module design and high-speed switching applications.
• Design and manufacture of jigs, fixtures and tooling.
• APQP, FMEA and engineering risk assessments.
• Project management and delivery of technical projects.
• Taking products from concept through prototype, qualification and production.
• Working with suppliers on the manufacture of components, tooling, jigs and fixtures.
• Experience working within a multidisciplinary R&D or product development environment.
• Membership of a relevant professional body such as the IET, IEEE or IOP.

Why Join Us?

This is an excellent opportunity to join a specialist R&D environment and work at the forefront of advanced power semiconductor packaging and power electronics technology.

You will have the opportunity to work on innovative Si C, Ga N and IGBT technologies, collaborate with experienced engineers and specialists across the business, and see your designs progress from early-stage concepts through to qualification and production.

The role also offers opportunities to broaden your technical knowledge through involvement in R&D projects, production support and cross-functional engineering activities, whilst developing your career within Dynex.

If you are a senior design engineer who enjoys solving complex engineering challenges and wants to work on technologies that will shape the future of power electronics, we would like to hear from you.