Semiconductor Packaging Process Engineer – NPI in Andover

Semiconductor Packaging Process Engineer – NPI in Andover

Andover Full-Time No working from home possible
Custom Interconnect Limited

At a Glance

  • Tasks: Support wafer process and encapsulation in semiconductor packaging.
  • Company: Join Custom Interconnect Limited, a leader in innovative technology.
  • Benefits: Competitive salary, health benefits, and opportunities for professional growth.
  • Other info: Dynamic work environment with potential for career advancement.
  • Why this job: Be part of a team driving continuous improvements in cutting-edge semiconductor processes.
  • Qualifications: Engineering background with a passion for process design and quality investigations.

Custom Interconnect Limited is seeking an engineer to support wafer process, die bond, wire bond or encapsulation within semiconductor packaging. The role covers operation, development and maintenance of processes and equipment.

You will work with Lead/Senior Engineers on process design, NPI, data collection and quality investigations to drive continuous improvements on the production floor.

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Semiconductor Packaging Process Engineer – NPI in Andover employer: Custom Interconnect Limited

As a Production Team Manager on the night shift, you will thrive in a dynamic and supportive work culture that prioritises employee satisfaction and professional growth. Our company offers comprehensive training opportunities, a collaborative environment, and a commitment to innovation, ensuring that you and your team can achieve both personal and organisational goals. Located in a vibrant area, we provide a unique chance to lead a dedicated team while enjoying the benefits of a flexible work schedule and a focus on work-life balance.

Custom Interconnect Limited

Contact Details:

Custom Interconnect Limited Recruitment Team

We think you need these skills to ace Semiconductor Packaging Process Engineer – NPI in Andover

Wafer Process Knowledge
Die Bonding Techniques
Wire Bonding Techniques
Encapsulation Processes
Process Development
Equipment Maintenance
Data Collection