At a Glance
- Tasks: Support wafer process and encapsulation in semiconductor packaging.
- Company: Custom Interconnect Limited, a leader in semiconductor technology.
- Benefits: Competitive salary, hands-on experience, and opportunities for growth.
- Other info: Collaborative environment with mentorship from experienced engineers.
- Why this job: Join a dynamic team and contribute to innovative semiconductor solutions.
- Qualifications: Engineering background with a passion for process improvement.
The predicted salary is between 40500 - 49500 £ per year.
Custom Interconnect Limited is seeking an engineer to support wafer process, die bond, wire bond or encapsulation within semiconductor packaging.
The role covers operation, development and maintenance of processes and equipment.
You will work with Lead/Senior Engineers on process design, NPI, data collection and quality investigations to drive continuous improvements on the production floor.
#J-18808-Ljbffr
Semiconductor Packaging Process Engineer – NPI in Andover employer: Custom Interconnect Limited
Custom Interconnect Limited is an excellent employer for those looking to make a significant impact in the semiconductor industry. With a strong focus on innovation and continuous improvement, employees benefit from a collaborative work culture that encourages professional growth and development. Located in a dynamic environment, the company offers unique opportunities to work alongside experienced engineers on cutting-edge projects, ensuring a rewarding and meaningful career path.
Contact Details:
Custom Interconnect Limited Recruitment Team
