Physical Designer Engineer

Physical Designer Engineer

Full-Time 50000 - 70000 £ / year (est.) No home office possible
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At a Glance

  • Tasks: Design advanced digital ASIC/AI/CPU chips and optimise layouts for performance.
  • Company: Leading tech firm at the forefront of semiconductor innovation.
  • Benefits: Attractive salary, flexible working options, and opportunities for skill development.
  • Other info: Fast-paced environment with potential for career advancement.
  • Why this job: Join a cutting-edge team and shape the future of technology.
  • Qualifications: Knowledge of IC development and physical design principles required.

The predicted salary is between 50000 - 70000 £ per year.

Responsibilities

  • Responsible for the physical design of advanced process digital ASIC/AI/CPU chips.
  • Layout design of analog/digital chips.
  • PPAC optimization under advanced processes.
  • Fully custom design and exploration of new technologies in advanced packaging.
  • Back-end physical implementation from gate-level netlist to GDSII.
  • Layout design of digital/analog chips, including PR, PV, IR signoff, PPAC optimization, and STA/Spice signoff.

Requirements

  • Understanding of the IC development.

Physical Designer Engineer employer: Consortium for Clinical Research and Innovation Singapore

As a leading innovator in the semiconductor industry, our company offers an exceptional work environment for Physical Design Engineers, fostering a culture of collaboration and creativity. Located in a vibrant tech hub, we provide competitive benefits, continuous professional development opportunities, and the chance to work on cutting-edge technologies that shape the future of AI and CPU design. Join us to be part of a dynamic team where your contributions are valued and your career can thrive.
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Contact Detail:

Consortium for Clinical Research and Innovation Singapore Recruiting Team

StudySmarter Expert Advice 🤫

We think this is how you could land Physical Designer Engineer

✨Tip Number 1

Network like a pro! Reach out to professionals in the semiconductor industry on LinkedIn or at local meetups. We can’t stress enough how valuable personal connections can be in landing that Physical Designer Engineer role.

✨Tip Number 2

Show off your skills! Create a portfolio showcasing your projects related to ASIC/AI/CPU chip design. We all know that actions speak louder than words, so let your work do the talking when you get the chance to chat with potential employers.

✨Tip Number 3

Prepare for technical interviews! Brush up on your knowledge of back-end physical implementation and PPAC optimisation. We recommend doing mock interviews with friends or using online platforms to simulate the real deal.

✨Tip Number 4

Apply through our website! We’ve got loads of opportunities waiting for talented Physical Designer Engineers like you. Don’t miss out on the chance to join us and make an impact in the world of advanced chip design.

We think you need these skills to ace Physical Designer Engineer

Physical Design of ASIC/AI/CPU Chips
Layout Design of Analog/Digital Chips
PPAC Optimization
Custom Design
Back-End Physical Implementation
Gate-Level Netlist to GDSII
PR Signoff
PV Signoff
IR Signoff
STA Signoff
Spice Signoff
Understanding of IC Development

Some tips for your application 🫡

Show Off Your Skills: Make sure to highlight your experience with physical design and ASIC/AI/CPU chips in your application. We want to see how your skills align with the responsibilities listed in the job description!

Tailor Your CV: Don’t just send a generic CV! Customise it to reflect the specific requirements of the Physical Designer Engineer role. We love seeing candidates who take the time to match their experience with what we’re looking for.

Be Clear and Concise: When writing your application, keep it straightforward. We appreciate clarity, so make sure your points are easy to read and get straight to the point about your qualifications and experiences.

Apply Through Our Website: We encourage you to apply directly through our website. It’s the best way for us to receive your application and ensures you’re considered for the role. Plus, it’s super easy!

How to prepare for a job interview at Consortium for Clinical Research and Innovation Singapore

✨Know Your Chips

Make sure you brush up on your knowledge of ASIC, AI, and CPU chip design. Be ready to discuss specific projects you've worked on, especially those involving layout design and PPAC optimisation. This will show that you understand the technical requirements of the role.

✨Master the Jargon

Familiarise yourself with terms like GDSII, PR, PV, IR signoff, and STA/Spice signoff. Using the right terminology during the interview will demonstrate your expertise and confidence in the field, making a great impression on the interviewers.

✨Showcase Your Problem-Solving Skills

Prepare examples of challenges you've faced in physical design and how you overcame them. Whether it was a tricky layout issue or optimising performance, sharing these experiences will highlight your critical thinking and adaptability.

✨Stay Updated on New Technologies

Research the latest advancements in advanced packaging and other relevant technologies. Being able to discuss new trends and how they could impact the role will show your enthusiasm for the industry and your commitment to continuous learning.

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