Position
Semiconductor Catapult is seeking a highly motivated Semiconductor Package Electrical Design Engineer to support the development of next-generation semiconductor packaging technologies.
The successful candidate will be responsible for the electrical design, modelling and validation of advanced packaging solutions, including 2.5D/ 3D and heterogeneous integration platforms for applications spanning AI, RF communications, photonics, power electronics and emerging semiconductor systems.
This role will work closely with mechanical, thermal, materials and assembly process engineers to develop high-performance, manufacturable and reliable semiconductor package solutions. As Advanced Packaging Design Engineer you will:
- Develop electrical designs for advanced semiconductor packages, interposers, substrates and heterogeneous integration platforms
- Design and optimise high-speed digital and RF interconnects from die-to-die, die-to-package and package-to-board levels
- Perform Signal Integrity (SI), Power Integrity (PI) and electromagnetic analysis to ensure robust electrical performance
- Define package stack-ups, routing architectures, bump maps and interconnect structures
- Develop simulation models and perform electrical characterisation using industry-standard tools
- Support design rule development and package co-design activities with customers, foundries, substrate suppliers and assembly partners
- Correlate simulation results with laboratory measurements and identify opportunities for design improvement
- Contribute to customer projects, collaborative R&D programmes and technology demonstrators
- Generate technical reports, design documentation and customer-facing presentations
The Candidate
- Ideally holds a Degree in Electrical Engineering, Electronic Engineering or a related discipline or qualified by suitable relevant experience
- Experience in electronic package design, electrical interface design, high frequency RF design, high-speed digital design or related fields
- Good understanding of: High-speed and high frequency package design; Signal Integrity (SI); Power Integrity (PI); Electromagnetic theory- transmission lines, impedance control, S-parameters, crosstalk and signal loss
- Experience with one or more of the following tools: Ansys HFSS / SIwave / Cadence Allegro Package Designer / Siemens Xpedition / CST Studio Suite / Keysight ADS
- Strong analytical and problem-solving skills
Other information
- Between £52,000 and £58,630 full time annual salary
- A non-contractual bonus scheme to allow everyone to share in our success
- Life Assurance - 4 times your annual salary
- Scottish Widows pension scheme - you put in 5% and we'll put in 10%
- 28 days leave in addition to 8 bank holidays
- A generous private medical insurance scheme for you and your family (enrolment once a year)
- A cashback scheme for your eye tests and dental treatment
- Payment for a professional membership each year
- Flexible working - we operate core hours of 10-4. The balance of your hours can be worked around what works for you
- Electric Vehicle and Cycle to work schemes
The close date for this position is 1st November 2026. We reserve the right to extend the advertising period or close early should enough sufficient applications be received.
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Advanced Packaging Design Engineer in Newport employer: Compound Semiconductor Applications (CSA) Catapult
At CSA Catapult, we pride ourselves on being an excellent employer that fosters a collaborative and innovative work culture. As a Skills Programme Lead, you will have the opportunity to make a meaningful impact in the STEM sector while benefiting from professional development opportunities and a supportive team environment. Our commitment to employee growth and the chance to engage with diverse stakeholders across academia and industry makes this role both rewarding and fulfilling.
Contact Details:
Compound Semiconductor Applications (CSA) Catapult Recruitment Team
